LIFCL-40-7SG72C

The LIFCL-40-7SG72C is a CrossLink-NX™ field programmable gate array (FPGA) IC from Lattice Semiconductor Corporation. It provides 39,000 logic elements and approximately 1.55 Mbits of embedded memory in a compact 72‑VFQFN exposed pad package, and is graded for commercial use.

This device targets designs that require a compact, low‑voltage FPGA solution with up to 40 I/O, a surface‑mount 10×10 QFN footprint, and a core supply range of 0.95 V to 1.05 V. Operating temperature is specified for commercial environments (0 °C to 85 °C).

Key Features

• Core Logic — 39,000 logic elements to implement combinational and sequential logic in compact FPGA designs.
• Embedded Memory — Approximately 1.55 Mbits of on‑chip RAM to support buffering, state storage, and local data processing.
• I/O Count — 40 user I/O pins to interface with peripherals, sensors, and external logic.
• Power — Core voltage supply range from 0.95 V to 1.05 V for low‑voltage system integration.
• Package and Mounting — 72‑VFQFN exposed pad (supplier device package: 72‑QFN, 10×10) optimized for surface‑mount assembly and efficient thermal path via the exposed pad.
• Temperature Grade — Commercial operating range of 0 °C to 85 °C suitable for mainstream electronic products.
• RoHS Compliance — Device is RoHS compliant.

Typical Applications

• Commercial embedded systems — Provides programmable logic, embedded memory, and 40 I/O for compact system controllers and feature‑rich consumer electronics within commercial temperature ranges.
• Low‑voltage FPGA designs — Suited for applications that require a core supply between 0.95 V and 1.05 V while maintaining a small QFN footprint.
• Space‑constrained board designs — 72‑VFQFN (10×10) package and exposed pad enable dense PCB layouts with improved thermal performance.

Unique Advantages

• Significant logic capacity: 39,000 logic elements deliver ample programmable resources for moderate to complex logic tasks without increasing board area.
• On‑chip memory: Approximately 1.55 Mbits of embedded RAM reduces dependence on external memory, simplifying BOM and layout.
• Compact, thermally aware package: 72‑VFQFN with exposed pad supports surface‑mount assembly and helps manage thermal dissipation in tight designs.
• Low core voltage compatibility: 0.95 V–1.05 V supply allows integration into low‑voltage system architectures.
• Commercial temperature suitability: Rated 0 °C to 85 °C for mainstream applications and product lines.
• RoHS compliant: Meets lead‑free requirements for modern electronics manufacturing.

Why Choose LIFCL-40-7SG72C?

The LIFCL-40-7SG72C delivers a balanced combination of logic capacity, embedded memory, and a compact QFN footprint for commercial FPGA applications. Its 39,000 logic elements and approximately 1.55 Mbits of on‑chip RAM provide the resources needed to implement moderate‑complexity designs while keeping board area and BOM under control.

This CrossLink-NX™ device is appropriate for designers seeking a low‑voltage, surface‑mount FPGA in a 10×10 QFN package with 40 I/O and commercial temperature rating. It offers a clear option for embedded and space‑constrained designs where programmable logic and local memory are required.

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