LIFCL-40-7SG72I
| Part Description |
CrossLink-NX™ Field Programmable Gate Array (FPGA) IC 40 1548288 39000 72-VFQFN Exposed Pad |
|---|---|
| Quantity | 751 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 72-QFN (10x10) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 72-VFQFN Exposed Pad | Number of I/O | 40 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 9750 | Number of Logic Elements/Cells | 39000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1548288 |
Overview of LIFCL-40-7SG72I – CrossLink-NX Field Programmable Gate Array, 40 I/O, 72-VFQFN Exposed Pad
The LIFCL-40-7SG72I is a CrossLink-NX Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It provides reconfigurable logic with 39,000 logic elements and approximately 1.55 Mbits of embedded memory for on-chip data buffering and state storage.
This device is offered in a compact 72-VFQFN exposed pad package (72-QFN, 10×10) with surface-mount mounting and supports a core supply range of 0.95 V to 1.05 V. It is specified for industrial-grade operation from −40 °C to 100 °C and is RoHS compliant.
Key Features
- Logic Capacity 39,000 logic elements to implement custom digital functions and small-to-moderate complex logic designs.
- Embedded Memory Approximately 1.55 Mbits of on-chip RAM for frame buffering, lookup tables, and intermediate data storage.
- I/O Count 40 general-purpose I/O pins suitable for interfacing with peripherals and external devices.
- Power Supply Core voltage support from 0.95 V to 1.05 V to match low-voltage system rails.
- Package & Mounting 72-VFQFN exposed pad (supplier package: 72-QFN, 10×10) designed for surface-mount assembly and thermal conduction through the exposed pad.
- Temperature Range & Grade Industrial-grade device rated for operation from −40 °C to 100 °C for deployment in temperature-challenging environments.
- Regulatory Compliance RoHS compliant for alignment with lead-free manufacturing requirements.
Unique Advantages
- High logic density: 39,000 logic elements provide the capacity to integrate custom combinational and sequential logic on-chip, reducing external component count.
- Substantial on-chip RAM: Approximately 1.55 Mbits of embedded memory helps minimize external memory needs for buffering and state retention.
- Industrial temperature performance: Rated from −40 °C to 100 °C to support designs that require extended ambient temperature capability.
- Compact exposed-pad package: 72-VFQFN with exposed pad supports compact board layouts and improved thermal path for dissipation.
- Low-voltage core operation: 0.95 V to 1.05 V supply range enables compatibility with low-voltage power domains.
- RoHS compliant: Conforms to lead-free manufacturing practices for easier integration into compliant assemblies.
Why Choose LIFCL-40-7SG72I?
The LIFCL-40-7SG72I delivers a balanced combination of logic capacity, embedded memory, and industrial-grade operating range in a compact 72-VFQFN exposed-pad package. Its specifications suit designs that need a reconfigurable logic device with solid on-chip resources and low-voltage core operation.
This part is appropriate for teams and projects that require a mid-density FPGA solution with defined thermal and electrical characteristics, and who value RoHS compliance and surface-mount packaging for streamlined assembly.
Request a quote or submit an inquiry to start the procurement process for the LIFCL-40-7SG72I CrossLink-NX FPGA and obtain pricing, lead-time, and availability details.
