LIFCL-40-8BG400C

IC FPGA 192 I/O 400CABGA
Part Description

CrossLink-NX™ Field Programmable Gate Array (FPGA) IC 192 1548288 39000 400-LFBGA

Quantity 325 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package400-CABGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case400-LFBGANumber of I/O192Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs9750Number of Logic Elements/Cells39000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits1548288

Overview of LIFCL-40-8BG400C – CrossLink-NX™ FPGA, 39,000 logic elements, ~1.55 Mbit RAM, 192 I/Os, 400-LFBGA

The LIFCL-40-8BG400C is a CrossLink-NX™ Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It provides a mid-density FPGA fabric with on-chip embedded memory and a high I/O count in a compact 400‑LFBGA package for commercial-grade designs.

Designed for applications that require configurable logic, multi-pin interfacing and embedded RAM, this device targets designers who need a balance of integration density, I/O capability and compact packaging for surface-mount PCB assembly.

Key Features

  • Logic Capacity — 39,000 logic elements for implementing custom digital functions and moderate-complexity designs.
  • Embedded Memory — Total on-chip RAM of 1,548,288 bits, approximately 1.55 Mbits of embedded memory for buffering, FIFOs and local data storage.
  • High I/O Count — 192 general-purpose I/Os to support multi-channel interfaces and parallel connectivity requirements.
  • Power and Core Voltage — Core voltage range of 0.95 V to 1.05 V to match system power-rail planning and core supply requirements.
  • Package & Mounting — 400-LFBGA (supplier package: 400-CABGA 17×17) in a surface-mount form factor for dense PCB implementations.
  • Operating Range & Grade — Commercial grade with operating temperature from 0 °C to 85 °C, suitable for general-purpose commercial applications.
  • Compliance — RoHS compliant, supporting environmental regulatory requirements for lead-free manufacturing.

Typical Applications

  • Interface and Protocol Bridging — Use the 192 I/Os and 39,000 logic elements to implement custom interface logic and protocol conversion on a single device.
  • Embedded Logic and Glue — Implement glue logic, control state machines and peripheral interfaces with available logic capacity and on-chip RAM for buffering.
  • Signal Buffering and Data Handling — Leverage approximately 1.55 Mbits of embedded memory for temporary data storage, FIFOs and stream buffering.
  • Prototyping and Development — Compact 400‑LFBGA package and surface-mount mounting make the device suitable for PCB-based prototypes and evaluation in commercial product designs.

Unique Advantages

  • Balanced Logic Density: 39,000 logic elements provide sufficient capacity for mid-range custom logic without excessive package complexity.
  • Significant On-Chip Memory: Approximately 1.55 Mbits of embedded RAM enables local buffering and storage, reducing external memory requirements.
  • Extensive I/O Resources: 192 I/Os allow for multiple parallel interfaces or high-pin-count connectivity directly from the FPGA.
  • Compact, Surface-Mount Package: 400-LFBGA (400-CABGA, 17×17) supports dense board layouts and modern assembly processes.
  • Commercial-Grade Reliability: Specified 0 °C to 85 °C operating range and RoHS compliance align with general commercial product requirements.
  • Low-Voltage Core Support: Core supply range of 0.95 V to 1.05 V enables integration with contemporary low-voltage power architectures.

Why Choose LIFCL-40-8BG400C?

The LIFCL-40-8BG400C positions itself as a commercially graded, mid-density CrossLink-NX FPGA that balances logic capacity, on-chip memory and a high I/O count in a compact 400‑LFBGA package. It is suitable for designers who require configurable hardware resources, local RAM for data handling and ample I/O in a surface-mount form factor.

Manufactured by Lattice Semiconductor Corporation and RoHS compliant, this device delivers a practical combination of integration and packaging for commercial embedded systems, interface logic and prototype-to-production use cases where moderate logic density and multi-pin connectivity are key.

Request a quote or submit your requirements to receive pricing and availability information for the LIFCL-40-8BG400C. Our team can assist with the next steps for procurement and integration into your design.

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