M1A3P250-FG144I

The M1A3P250-FG144I is a ProASIC3 Field Programmable Gate Array (FPGA) IC designed for industrial applications. It provides 6,144 logic elements and approximately 36,864 bits of embedded memory to implement mid-density programmable logic and custom interfacing.

With 97 user I/Os, a compact 144-LBGA / 144-FPBGA (13×13) package, and an industrial operating range, this device targets designs that require robust, surface-mount programmable logic with a defined power and thermal profile.

Key Features

• Core & Logic — 6,144 logic elements supporting up to 250,000 gates for mid-density programmable logic and custom glue logic implementations.
• Embedded Memory — Approximately 0.037 Mbits of on-chip RAM (36,864 bits) for small buffers, state machines, and control storage.
• I/O Capacity — 97 user I/Os to support multiple peripheral interfaces, sensor paths, and control signals on a single device.
• Power — Single-supply operation with a specified voltage range of 1.425 V to 1.575 V to match system power domains precisely.
• Package & Mounting — 144-LBGA package (supplier package: 144-FPBGA, 13×13); surface-mount mounting for compact PCB integration.
• Temperature & Grade — Industrial grade operation from −40 °C to 100 °C for demanding ambient conditions.
• Compliance — RoHS-compliant to support regulatory and manufacturing requirements.

Typical Applications

• Industrial Control — Implement control logic and interfacing in factory and process automation systems that require industrial temperature support.
• Interface and Glue Logic — Consolidate multiple interface functions and protocol conversions using the device’s 97 I/Os and programmable logic.
• Embedded System Modules — Provide mid-density programmable logic and small on-chip memory for custom peripherals and board-level subsystems.
• Signal Management — Perform aggregation, routing, and simple processing of digital signals where a compact BGA footprint is required.

Unique Advantages

• Balanced Logic Density: 6,144 logic elements and 250,000 gates deliver capacity for mid-size designs without excessive board area.
• Compact Package: 144-LBGA / 144-FPBGA (13×13) allows integration into space-constrained PCBs while exposing a large number of I/Os.
• Industrial Temperature Range: −40 °C to 100 °C operation supports deployments in demanding ambient environments.
• Precise Power Requirement: Narrow supply window (1.425 V–1.575 V) enables predictable power budgeting and compatibility with tightly controlled supply rails.
• Surface-Mount Convenience: Surface-mount mounting simplifies automated PCB assembly and high-density board designs.
• Regulatory Compatibility: RoHS compliance aligns with modern lead-free manufacturing practices.

Why Choose M1A3P250-FG144I?

The M1A3P250-FG144I positions itself as a mid-density, industrial-grade FPGA option offering a practical balance of logic elements, I/O count, and embedded memory in a compact BGA package. Its defined supply range and extended temperature rating make it suitable for equipment and modules that require reliable programmable logic in constrained footprints.

This device is well suited for engineers and procurement teams looking for a programmable solution that combines measurable logic capacity, ample I/O, and industrial robustness, delivering scalability and predictable integration into existing power and thermal designs.

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