M1A3P250-2VQG100
| Part Description |
ProASIC3 Field Programmable Gate Array (FPGA) IC 68 36864 100-TQFP |
|---|---|
| Quantity | 1,249 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 100-VQFP (14x14) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 100-TQFP | Number of I/O | 68 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 6144 | Number of Logic Elements/Cells | 6144 | ||
| Number of Gates | 250000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 36864 |
Overview of M1A3P250-2VQG100 – ProASIC3 Field Programmable Gate Array (FPGA) IC 68 36864 100-TQFP
The M1A3P250-2VQG100 is a ProASIC3 family FPGA IC from Microchip Technology, offering a mid-range programmable logic device with 6,144 logic elements and 250,000 equivalent gates. It provides a balance of logic density, on-chip memory and I/O for commercial-grade embedded designs.
Designed for surface-mount assembly in a 100-pin TQFP package, this device targets applications that require configurable logic, moderate embedded memory and flexible interfacing within a commercial temperature range.
Key Features
- Logic Capacity — 6,144 logic elements (cells) providing the core programmable resources for implementing custom logic and glue functions.
- Gate Count — 250,000 equivalent gates to quantify overall device complexity for system partitioning and sizing.
- Embedded Memory — Approximately 0.037 Mbits of on-chip RAM (36,864 bits) for small buffers, FIFOs or configuration storage.
- I/O Resources — 68 general-purpose I/O pins to support multiple peripheral interfaces and board-level signal routing.
- Power Supply — Operates from a core voltage range of 1.425 V to 1.575 V to match system power-rail requirements.
- Package & Mounting — 100-TQFP (supplier device package: 100-VQFP, 14×14) in a surface-mount form factor for compact PCB layouts.
- Temperature & Grade — Commercial grade operation from 0°C to 85°C, suitable for standard commercial embedded applications.
- Compliance — RoHS compliant.
Typical Applications
- Interface Bridging and Glue Logic — Use the device's 68 I/O pins and 6,144 logic elements to implement protocol adaptation, signal translation and board-level glue logic.
- Custom Peripheral Implementation — Implement custom digital peripherals and timing-critical logic blocks using the available gates and logic elements.
- Prototyping and Evaluation — Rapidly iterate hardware designs that require reprogrammable logic capacity and modest on-chip RAM for test buffers or state storage.
Unique Advantages
- Balanced Logic and Memory: 6,144 logic elements combined with ~0.037 Mbits of embedded RAM enable efficient implementation of moderate-complexity functions without external memory.
- Substantial Gate Count: 250,000 equivalent gates provide a clear metric for system partitioning and capacity planning in embedded designs.
- Compact, Surface-Mount Package: 100-TQFP (100-VQFP, 14×14) allows space-efficient placement on densely populated PCBs while maintaining access to ample I/O.
- Commercial Temperature Range: Rated 0°C to 85°C for reliable operation across typical commercial environments.
- Low-Noise Core Supply Window: Tight core voltage range (1.425 V–1.575 V) supports predictable power budgeting and supply design.
Why Choose M1A3P250-2VQG100?
The M1A3P250-2VQG100 positions itself as a practical, mid-density programmable logic solution within the ProASIC3 family from Microchip Technology. Its 6,144 logic elements, 250,000 gate-equivalent capacity and modest embedded memory make it well suited for designers who need reconfigurable logic, flexible I/O and a compact package for commercial embedded products.
This device is a fit for engineering teams focused on prototyping, interface adaptation and custom peripheral implementation where predictable power, a surface-mount 100-TQFP package and commercial-grade temperature operation are required. Choosing this part supports scalable, maintainable designs with vendor-backed FPGA technology.
Request a quote or submit a procurement inquiry to get pricing and lead-time information for the M1A3P250-2VQG100.

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