M1A3P250-2PQG208

The M1A3P250-2PQG208 is a ProASIC3 field programmable gate array (FPGA) offering 6,144 logic elements and approximately 0.037 Mbits of on-chip RAM. With 151 I/O pins, 250,000 logical gates and a 208-BFQFP package, this device targets commercial embedded designs that require reconfigurable logic, moderate I/O density and a compact surface-mount package.

Designed for operation from 1.425 V to 1.575 V and a commercial temperature range of 0 °C to 85 °C, the M1A3P250-2PQG208 provides a balance of integration and predictable electrical and thermal operating windows for OEM applications.

Key Features

• Logic Capacity  6,144 logic elements and 250,000 gates to implement custom combinational and sequential logic functions.
• Embedded Memory  Approximately 0.037 Mbits of total on-chip RAM for small buffers, FIFOs or state storage.
• I/O Count  151 general-purpose I/O pins provide flexible external interfacing options for sensors, peripherals and bus connections.
• Power  Specified supply voltage range of 1.425 V to 1.575 V for core power budgeting and regulator selection.
• Package & Mounting  208-BFQFP (208-PQFP, 28×28) surface-mount package for compact PCB implementations.
• Operating Conditions  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Regulatory  RoHS compliant for lead-free manufacturing processes.

Typical Applications

• Embedded Control  Use the FPGA for glue logic, protocol conversion and control functions in commercial embedded systems where reconfigurable logic simplifies design updates.
• Interface & I/O Aggregation  151 I/O pins enable aggregation and buffering of peripheral connections, sensor interfaces and custom bus implementations.
• Prototyping & Low- to Mid-Volume Products  Programmable logic and on-chip memory support rapid iteration of hardware functions during development and for production runs.

Unique Advantages

• Compact logic density: 6,144 logic elements deliver substantial programmable capacity in a single-package solution, reducing external component count.
• Flexible I/O resources: 151 I/O pins provide design flexibility for diverse interfacing needs without resorting to additional I/O expanders.
• Predictable power envelope: A defined supply range of 1.425 V–1.575 V simplifies power-supply design and component selection.
• Surface-mount, production-ready package: 208-BFQFP packaging supports compact PCB layouts and standard SMT assembly processes.
• Commercial temperature rating: Rated 0 °C to 85 °C to match typical commercial electronics operating environments.
• RoHS compliance: Conforms to lead-free manufacturing requirements for regulatory and environmental compliance.

Why Choose M1A3P250-2PQG208?

The M1A3P250-2PQG208 combines a mid-range logic element count, modest embedded memory and a high I/O count in a compact 208-BFQFP surface-mount package. It is well suited to commercial embedded designs that require reconfigurable logic, moderate buffering and a defined power and thermal window.

For engineers and procurement teams seeking a programmable solution with clear, verifiable specifications—logic capacity, I/O count, supply and temperature ranges—the M1A3P250-2PQG208 offers a straightforward option that integrates into standard SMT workflows and RoHS-compliant manufacturing.

Request a quote or submit an inquiry to receive pricing and availability information for the M1A3P250-2PQG208. Technical and purchasing teams can provide details to support procurement and design planning.