M1A3P250-2PQG208I

The M1A3P250-2PQG208I is a ProASIC3 field programmable gate array (FPGA) from Microchip Technology designed for industrial applications that require reconfigurable logic in a surface-mount package. It provides a blend of programmable logic, on-chip memory, and a broad I/O complement for embedded control and signal-processing tasks.

With 6,144 logic elements (approximately 250,000 gates), roughly 36,864 bits of embedded memory, 151 general-purpose I/Os, and an industrial temperature rating, this device targets designs that need moderate logic density combined with robust operating voltage and temperature specifications.

Key Features

• Core Logic — 6,144 logic elements providing the equivalent of approximately 250,000 gates for implementing custom logic, sequencing, and control functions.
• Embedded Memory — Approximately 36,864 bits of on-chip RAM to support buffering, small lookup tables, and local data storage without external memory.
• I/O Capacity — 151 programmable I/O pins for interfacing to peripherals, sensors, buses, and other system components.
• Package & Mounting — Supplied in a 208-BFQFP surface-mount package (208-PQFP, 28×28), enabling compact board layouts and high pin count routing.
• Power — Core voltage supply specified between 1.425 V and 1.575 V to match system power rails and design requirements.
• Temperature & Grade — Industrial-grade device rated for operation from −40 °C to 100 °C, suitable for demanding environmental conditions.
• Compliance — RoHS compliant, aligning with common environmental and manufacturing requirements.

Typical Applications

• Industrial Control — Implement custom control logic, finite-state machines, and I/O aggregation in factory automation or machine control equipment using the device’s industrial temperature rating and plentiful I/O.
• Embedded Processing — Offload deterministic logic tasks and small-data buffering with on-chip RAM and 6,144 logic elements to accelerate system response times.
• Interface Bridging — Use the 151 I/Os to bridge multiple peripheral interfaces and sensor arrays in embedded systems requiring flexible pin allocations.

Unique Advantages

• Balanced Logic Density: 6,144 logic elements provide substantial programmable resources for mid-range FPGA designs without excessive board space.
• On-chip Memory: Approximately 36,864 bits of embedded RAM reduce the need for external memory for small buffers and lookup tables, simplifying BOM and layout.
• High I/O Count: 151 I/Os enable flexible connectivity to sensors, interfaces, and peripheral devices, minimizing supplementary I/O expanders.
• Industrial Reliability: Rated for −40 °C to 100 °C operation, suitable for deployment in environments with wide temperature swings.
• Compact Surface-Mount Package: 208-BFQFP (208-PQFP, 28×28) offers a high-pin-count solution that supports compact PCB implementations.
• RoHS Compliant: Supports environmental and manufacturing compliance requirements.

Why Choose M1A3P250-2PQG208I?

The M1A3P250-2PQG208I positions itself as a practical mid-density FPGA solution from Microchip Technology, combining 6,144 logic elements, approximately 36,864 bits of embedded RAM, and 151 I/Os in a standard 208-BFQFP surface-mount package. Its specified core voltage range and industrial temperature rating make it suitable for embedded and industrial designs that require reconfigurable logic with reliable environmental performance.

This device is well suited for engineers building control systems, interface bridges, and embedded processing modules who need predictable electrical and thermal behavior, compact packaging, and a balance of logic and memory resources for scalable implementations.

Request a quote or submit a pricing and availability inquiry to get more information on M1A3P250-2PQG208I and how it can fit into your next design.