M1A3P250-2FGG144I

The M1A3P250-2FGG144I is a ProASIC3 Field Programmable Gate Array (FPGA) IC offering 6,144 logic elements and 36,864 bits of on-chip RAM. It provides 97 user I/O pins and an estimated 250,000 gates of logic capacity in a compact 144-LBGA package.

Specified as industrial grade, this device supports a supply voltage range of 1.425 V to 1.575 V and an operating temperature range of −40 °C to 100 °C, making it suitable for designs that require stable operation across extended temperature environments.

Key Features

• Logic Capacity  6,144 logic elements (LEs) and approximately 250,000 gates for implementing custom digital functions and state machines.
• Embedded Memory  36,864 bits of on-chip RAM to support buffers, small FIFOs, and local data storage.
• I/O Count  97 general-purpose I/O pins to interface with peripherals, sensors, and external logic.
• Package & Mounting  144-LBGA package (supplier package: 144-FPBGA, 13 × 13 mm) designed for surface-mount assembly in compact PCBs.
• Power  Specified supply voltage range of 1.425 V to 1.575 V for core operation.
• Temperature Grade  Industrial operating temperature range from −40 °C to 100 °C for extended-environment deployments.
• Compliance  RoHS compliant.

Typical Applications

• Industrial Control  Logic integration and I/O handling for control systems that require industrial temperature operation and compact surface-mount packaging.
• Embedded Processing  Custom glue logic, protocol handling, and small-scale data buffering using on-chip RAM and the available logic elements.
• Sensor and Instrumentation Interfaces  Interfacing multiple sensors or peripherals using the device’s 97 I/O pins and implementing real-time signal handling in programmable logic.

Unique Advantages

• Flexible logic density: The 6,144 logic elements and ~250,000 gates provide a balance of capacity for mid-density FPGA designs without excess footprint.
• On-chip memory for local buffering: 36,864 bits of embedded RAM enable small data storage and FIFO implementations without external memory.
• Industrial temperature support: Rated from −40 °C to 100 °C to help ensure reliable operation in demanding environments.
• Compact surface-mount package: 144-LBGA (144-FPBGA, 13 × 13 mm) enables high-density PCB layouts and space-efficient system designs.
• RoHS compliant: Meets RoHS environmental requirements for easier regulatory alignment in product designs.

Why Choose M1A3P250-2FGG144I?

The M1A3P250-2FGG144I is positioned as a mid-density, industrial-grade FPGA solution that combines a practical logic element count, embedded RAM, and a relatively high I/O count in a compact LBGA package. Its specified supply voltage and extended operating temperature make it appropriate for engineered designs that require predictable electrical characteristics and environmental resilience.

Designers and procurement teams seeking a programmable logic device for control, interfacing, and embedded processing tasks will find this device offers a balanced combination of capacity, packaging, and industrial qualification for long-term deployments.

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