M1A3P250-2FG144I

IC FPGA 97 I/O 144FBGA
Part Description

ProASIC3 Field Programmable Gate Array (FPGA) IC 97 36864 144-LBGA

Quantity 99 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Device Package144-FPBGA (13x13)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case144-LBGANumber of I/O97Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs6144Number of Logic Elements/Cells6144
Number of Gates250000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits36864

Overview of M1A3P250-2FG144I – ProASIC3 FPGA, 6144 logic elements, 97 I/Os

The M1A3P250-2FG144I is a ProASIC3 Field Programmable Gate Array (FPGA) IC from Microchip Technology, offered in a 144-LBGA package. It combines 6,144 logic elements, approximately 0.037 Mbits of embedded memory, and 97 I/Os to support mid-density programmable logic integration.

Designed for surface-mount assembly and rated for industrial operation, this FPGA targets applications that require a balance of gate count, on-chip memory, and robust temperature tolerance within a compact FPBGA footprint.

Key Features

  • Core Logic 6,144 logic elements (cells) and a gate count of 250,000 provide the programmable fabric for custom digital designs.
  • Embedded Memory Total on-chip RAM of 36,864 bits—approximately 0.037 Mbits—suitable for small fast buffers and state storage.
  • General-Purpose I/O 97 I/O pins enable a variety of peripheral and interface connections for system integration.
  • Power Specified supply voltage range of 1.425 V to 1.575 V for core operation.
  • Package and Mounting 144-LBGA package (supplier device package: 144-FPBGA, 13×13) designed for surface-mount assembly to save PCB space.
  • Operating Range Industrial temperature rating from −40 °C to 100 °C for deployment in harsh environments.
  • Compliance RoHS-compliant construction supporting regulatory requirements for lead-free assembly.

Unique Advantages

  • Balanced Logic Density: 6,144 logic elements provide a mid-density solution for consolidating discrete logic into a single programmable device.
  • Compact, High-Parcel Package: 144-LBGA (13×13 FPBGA) package lets you implement substantial logic in a small board footprint.
  • Industrial Temperature Support: Rated from −40 °C to 100 °C, enabling reliable operation across extended environmental conditions.
  • On-Chip Memory: Approximately 0.037 Mbits of embedded RAM for local buffering and state retention without external memory.
  • Predictable Power Window: Narrow supply voltage range (1.425 V–1.575 V) supports consistent core behavior and margin planning.
  • RoHS Compliance: Meets lead-free manufacturing requirements for modern electronics production.

Why Choose M1A3P250-2FG144I?

The M1A3P250-2FG144I positions itself as a practical, industrial-grade ProASIC3 FPGA option for designs that require mid-level programmable logic, modest on-chip memory, and a robust operating temperature range. Its 6144 logic elements and 97 I/Os enable consolidation of logic and interfacing in a single device while the 144-LBGA footprint keeps PCB area efficient.

With a defined supply voltage window and RoHS compliance, this FPGA is suited for engineering teams seeking a verifiable hardware building block that aligns with industrial production and environmental requirements. Backed by Microchip Technology’s ProASIC3 family lineage, it fits designs needing dependable, field-programmable logic capacity.

Request a quote or submit a sales inquiry to evaluate the M1A3P250-2FG144I for your next project and receive pricing and availability information tailored to your volume and delivery needs.

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