M1A3P250-2FG144I
| Part Description |
ProASIC3 Field Programmable Gate Array (FPGA) IC 97 36864 144-LBGA |
|---|---|
| Quantity | 99 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-FPBGA (13x13) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LBGA | Number of I/O | 97 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 6144 | Number of Logic Elements/Cells | 6144 | ||
| Number of Gates | 250000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 36864 |
Overview of M1A3P250-2FG144I – ProASIC3 FPGA, 6144 logic elements, 97 I/Os
The M1A3P250-2FG144I is a ProASIC3 Field Programmable Gate Array (FPGA) IC from Microchip Technology, offered in a 144-LBGA package. It combines 6,144 logic elements, approximately 0.037 Mbits of embedded memory, and 97 I/Os to support mid-density programmable logic integration.
Designed for surface-mount assembly and rated for industrial operation, this FPGA targets applications that require a balance of gate count, on-chip memory, and robust temperature tolerance within a compact FPBGA footprint.
Key Features
- Core Logic 6,144 logic elements (cells) and a gate count of 250,000 provide the programmable fabric for custom digital designs.
- Embedded Memory Total on-chip RAM of 36,864 bits—approximately 0.037 Mbits—suitable for small fast buffers and state storage.
- General-Purpose I/O 97 I/O pins enable a variety of peripheral and interface connections for system integration.
- Power Specified supply voltage range of 1.425 V to 1.575 V for core operation.
- Package and Mounting 144-LBGA package (supplier device package: 144-FPBGA, 13×13) designed for surface-mount assembly to save PCB space.
- Operating Range Industrial temperature rating from −40 °C to 100 °C for deployment in harsh environments.
- Compliance RoHS-compliant construction supporting regulatory requirements for lead-free assembly.
Unique Advantages
- Balanced Logic Density: 6,144 logic elements provide a mid-density solution for consolidating discrete logic into a single programmable device.
- Compact, High-Parcel Package: 144-LBGA (13×13 FPBGA) package lets you implement substantial logic in a small board footprint.
- Industrial Temperature Support: Rated from −40 °C to 100 °C, enabling reliable operation across extended environmental conditions.
- On-Chip Memory: Approximately 0.037 Mbits of embedded RAM for local buffering and state retention without external memory.
- Predictable Power Window: Narrow supply voltage range (1.425 V–1.575 V) supports consistent core behavior and margin planning.
- RoHS Compliance: Meets lead-free manufacturing requirements for modern electronics production.
Why Choose M1A3P250-2FG144I?
The M1A3P250-2FG144I positions itself as a practical, industrial-grade ProASIC3 FPGA option for designs that require mid-level programmable logic, modest on-chip memory, and a robust operating temperature range. Its 6144 logic elements and 97 I/Os enable consolidation of logic and interfacing in a single device while the 144-LBGA footprint keeps PCB area efficient.
With a defined supply voltage window and RoHS compliance, this FPGA is suited for engineering teams seeking a verifiable hardware building block that aligns with industrial production and environmental requirements. Backed by Microchip Technology’s ProASIC3 family lineage, it fits designs needing dependable, field-programmable logic capacity.
Request a quote or submit a sales inquiry to evaluate the M1A3P250-2FG144I for your next project and receive pricing and availability information tailored to your volume and delivery needs.

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