M1A3P250-2FG144

The M1A3P250-2FG144 is a ProASIC3 Field Programmable Gate Array (FPGA) IC from Microchip Technology, delivering mid-range programmable logic capacity in a compact BGA package. It targets commercial-grade designs that require flexible I/O, on-chip memory, and a moderate logic element count for custom digital functions.

With 6,144 logic elements and approximately 250,000 gates, this device is suited to applications where balanced logic density, defined operating conditions, and surface-mount packaging are key considerations.

Key Features

• Core Logic 6,144 logic elements providing approximately 250,000 equivalent gates for implementing custom digital functions and moderate-complexity logic.
• Embedded Memory 36,864 bits of on-chip RAM (approximately 0.037 Mbits) for small buffers, FIFOs, and state storage.
• I/O Capacity 97 user I/O pins to support multiple peripheral interfaces and signal routings on a single device.
• Power Supply Operates from a 1.425 V to 1.575 V supply, enabling integration with low-voltage system domains.
• Package & Mounting 144-LBGA package (supplier device package: 144-FPBGA, 13×13) in a surface-mount form factor for compact board layouts.
• Operating Range & Grade Commercial grade with an operating temperature range of 0 °C to 85 °C for standard commercial applications.
• Environmental Compliance RoHS compliant to meet common lead-free manufacturing requirements.

Typical Applications

• Embedded Systems Implement custom control logic, protocol bridging, or peripheral aggregation using the device's 6,144 logic elements and available I/O.
• Interface and I/O Expansion Use the 97 I/O pins to consolidate multiple interfaces and offload glue logic in compact system designs.
• Digital Signal Glue Logic Leverage on-chip RAM and programmable logic for buffering, simple data-path processing, and timing alignment between subsystems.

Unique Advantages

• Balanced Logic Density: 6,144 logic elements and ~250,000 gates provide a mid-range capacity suitable for moderately complex designs without excessive footprint.
• Compact LBGA Packaging: 144-LBGA (144-FPBGA, 13×13) reduces board area while supporting a substantial I/O count for dense designs.
• Low-Voltage Operation: Narrow supply range (1.425 V–1.575 V) that aligns with modern low-voltage system domains.
• On-Chip Memory: Embedded 36,864 bits of RAM for local buffering and state retention, minimizing external memory requirements for small datasets.
• Commercial Ready: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial manufacturing and deployment.

Why Choose M1A3P250-2FG144?

The M1A3P250-2FG144 delivers a pragmatic balance of logic capacity, I/O flexibility, and compact packaging for commercial electronic designs. Its 6,144 logic elements, 97 I/O pins, and on-chip RAM make it suitable for projects that require customizable digital functions without moving to higher-cost, higher-density devices.

Backed by Microchip Technology and supplied in a 144-LBGA surface-mount package, this device is intended for engineers and procurement teams seeking a RoHS-compliant, commercially rated FPGA option for mid-range programmable logic needs.

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