M1A3P250-FGG144I

The M1A3P250-FGG144I is a ProASIC3 Field Programmable Gate Array (FPGA) from Microchip Technology designed for industrial-grade embedded logic applications. It provides a balance of logic density, embedded memory and I/O capacity in a compact surface-mount BGA package for space-constrained boards.

With 6,144 logic elements, approximately 36.9 kbits of on-chip RAM and 97 I/O pins, this device targets applications that require moderate programmable logic, deterministic I/O count and operation across a broad industrial temperature range.

Key Features

• Core Logic 6,144 logic elements (LEs) delivering approximately 250,000 gates of programmable logic for combinational and sequential functions.
• Embedded Memory Approximately 36,864 bits of on-chip RAM to support buffering, state storage and small data tables.
• I/O Capacity 97 I/O pins suitable for interfacing with multiple peripherals, sensors and external logic devices.
• Power Specified supply voltage range of 1.425 V to 1.575 V to match low-voltage system domains.
• Package & Mounting 144-LBGA package in a surface-mount form factor; supplier device package listed as 144-FPBGA (13x13).
• Temperature & Grade Industrial-grade part with an operating temperature range from −40 °C to 100 °C for deployment in demanding environments.
• Compliance RoHS compliant to meet common environmental supply-chain requirements.

Typical Applications

• Industrial control systems — Use the device for programmable logic tasks, I/O aggregation and small on-chip buffering where industrial temperature operation is required.
• Embedded system glue logic — Implement custom interface logic, protocol conversion and peripheral management using available logic elements and I/O.
• Sensor and actuator interfacing — Leverage the 97 I/O pins and on-chip memory for signal conditioning, timing and local data capture in embedded sensor nodes.

Unique Advantages

• Compact, high-density logic: 6,144 logic elements and ~250,000 gates provide a balanced capacity for medium-complexity designs without a large footprint.
• On-chip memory for local buffering: Approximately 36.9 kbits of embedded RAM reduces external memory needs for small data stores and state machines.
• Generous I/O count: 97 I/O pins allow flexible interfacing to multiple peripherals and external logic devices.
• Industrial temperature range: Rated from −40 °C to 100 °C to support reliable operation in harsher environments.
• Low-voltage operation: Narrow supply range (1.425 V–1.575 V) enables integration into low-voltage system domains.
• Surface-mount BGA packaging: 144-LBGA (supplier: 144-FPBGA (13x13)) supports high-density PCB assemblies and automated placement.

Why Choose M1A3P250-FGG144I?

The M1A3P250-FGG144I positions itself as a practical, industrial-grade FPGA option for designers needing a mid-range combination of logic, memory and I/O in a compact package. Its 6,144 logic elements, embedded RAM and 97 I/Os make it suitable for embedded control, interface bridging and sensor/actuator tasks where thermal and environmental resilience matter.

Backed by Microchip Technology’s ProASIC3 family pedigree, this device offers a clear technical profile for teams focused on deterministic hardware design, compact board layouts and long-term supply continuity in industrial applications.

Request a quote or submit a product inquiry for pricing and availability of the M1A3P250-FGG144I to begin evaluation or to obtain volume pricing and lead-time information.