M1A3P250-PQG208I

The M1A3P250-PQG208I is a ProASIC3 family FPGA from Microchip Technology designed for mid-density programmable logic applications. It integrates 250,000 gates, 6,144 logic elements, and approximately 36,864 bits of on-chip RAM in a 208-pin BFQFP surface-mount package.

With 151 user I/Os, a defined supply range of 1.425 V to 1.575 V and an industrial operating temperature of -40 °C to 100 °C, this device addresses designs that require reconfigurable logic, robust I/O count and operation across extended temperature environments.

Key Features

• Logic Density — 250,000 gates and 6,144 logic elements provide mid-range programmable logic capacity for complex glue logic, state machines and custom datapaths.
• Embedded Memory — Approximately 36,864 bits of on-chip RAM support buffering, small FIFOs and local storage for control and data processing tasks.
• I/O Count — 151 user I/Os allow flexible interfacing to sensors, peripherals and external devices without immediate need for external I/O expanders.
• Power Supply — Operates from a specified core voltage range of 1.425 V to 1.575 V to match system power rails and enable predictable power design.
• Package and Mounting — Supplied in a 208-BFQFP (supplier device package: 208-PQFP, 28 × 28) surface-mount package suitable for automated PCB assembly.
• Industrial Temperature Range — Rated for -40 °C to 100 °C for deployment in industrial and other temperature-challenging environments.
• Regulatory Status — RoHS compliant for lead-free assembly and regulatory alignment in many global markets.

Typical Applications

• Industrial Control — Implement custom control logic, signal conditioning and I/O aggregation where operation across extended temperatures is required.
• Embedded Systems — Provide programmable glue logic, peripheral interfaces and on-chip memory for compact embedded designs.
• Communications and Networking — Handle protocol bridging and custom packet processing functions that benefit from moderate logic density and ample I/O.
• Test and Measurement — Realize configurable timing, data capture and preprocessing functions using the device’s logic elements and embedded RAM.

Unique Advantages

• Balanced Logic and Memory — The combination of 6,144 logic elements and approximately 36,864 bits of RAM supports a wide range of mid-complexity designs without excessive external components.
• Substantial I/O Availability — 151 user I/Os reduce the need for external multiplexers or expanders, simplifying board-level design.
• Industrial-Grade Operation — Rated operation from -40 °C to 100 °C enables deployment in industrial environments and systems with extended temperature requirements.
• Clear Power Envelope — A defined core voltage range of 1.425 V to 1.575 V helps streamline power-supply design and component selection.
• Surface-Mount Package — 208-BFQFP (208-PQFP 28×28) packaging supports automated assembly and standard PCB layout practices.
• RoHS Compliant — Facilitates lead-free manufacturing and supports environmental regulatory requirements.

Why Choose M1A3P250-PQG208I?

The M1A3P250-PQG208I positions itself as a practical mid-density FPGA option that combines a meaningful complement of logic elements, embedded memory and high I/O count in a 208-pin surface-mount package. Its industrial temperature rating and defined supply voltage make it suitable for designs that require reliable operation across a wide temperature range.

This device is well suited to engineers and system designers seeking a reprogrammable logic element for industrial control, embedded systems, communications and test applications where the balance of logic capacity, memory and I/O count reduces board-level complexity and supports robust product development.

Request a quote or contact sales to discuss availability, lead times and volume pricing for the M1A3P250-PQG208I. Our team can provide ordering details and support for integrating this device into your next design.