M1A3P250-VQG100I

The M1A3P250-VQG100I is a ProASIC3 field programmable gate array (FPGA) from Microchip Technology designed for industrial-grade embedded logic applications. It provides 6,144 logic elements and roughly 36,864 bits of on-chip RAM to implement combinational and sequential functions, interfaces, and glue logic on a surface-mount 100-pin TQFP package.

With 68 user I/O pins, a 1.425–1.575 V core voltage range and an operating temperature range of −40 °C to 100 °C, this device is specified for deployment in industrial environments that require a compact, configurable logic solution.

Key Features

• Core Logic 6,144 logic elements provide flexible resources for implementing custom digital logic and control functions.
• Embedded Memory Approximately 36,864 bits (≈0.037 Mbits) of on-chip RAM for small data buffers, FIFOs, and state storage.
• I/O Capacity 68 general-purpose I/O pins support a variety of board-level interfacing and peripheral connections.
• Gate Count 250,000 gates to characterize the device’s logic density and integration capability for medium-complexity designs.
• Power Core supply voltage specified at 1.425 V to 1.575 V for deterministic power planning and system design.
• Package & Mounting Supplied in a 100-TQFP (100-VQFP, 14 × 14 mm) surface-mount package for PCB assembly in space-constrained systems.
• Industrial Temperature Range Rated for −40 °C to 100 °C operation to meet thermal requirements of industrial applications.
• Regulatory Status RoHS compliant, supporting environmentally conscious manufacturing and supply chain requirements.

Typical Applications

• Industrial Control Implement control logic and interface functions in industrial equipment where extended temperature range and industrial-grade components are required.
• Embedded Systems Use as a compact programmable logic resource for embedded designs requiring moderate logic density and on-chip RAM.
• I/O Expansion & Glue Logic Provide customizable I/O interfacing, protocol bridging, and glue logic on a small-footprint surface-mount package.

Unique Advantages

• Balanced Logic Density: 6,144 logic elements and 250,000 gates deliver a balance of resources for medium-complexity designs without overprovisioning.
• Compact, PCB-Friendly Package: 100-TQFP surface-mount package (14 × 14 mm) enables integration into space-constrained boards while maintaining serviceable I/O.
• Industrial Reliability: Specified for −40 °C to 100 °C operation and labeled as industrial grade, supporting deployment in harsher environments.
• Predictable Power Envelope: Defined core voltage range (1.425–1.575 V) simplifies power-supply design and system integration.
• Regulatory Compliance: RoHS compliance supports environmentally driven procurement and manufacturing practices.

Why Choose M1A3P250-VQG100I?

The M1A3P250-VQG100I positions itself as a practical, industrial-grade FPGA choice for engineers needing a compact, configurable logic device with a defined operating temperature range and predictable power requirements. Its combination of 6,144 logic elements, 68 I/O pins, and on-chip RAM makes it suitable for embedded control, interfacing, and glue-logic roles where board space and environmental robustness matter.

Backed by Microchip Technology and provided in a standard 100-TQFP surface-mount package, this device offers a straightforward path for designers seeking a reliable, mid-density FPGA for industrial applications and production designs.

Request a quote or submit an inquiry for pricing and availability of the M1A3P250-VQG100I to start your design evaluation.