M1A3P400-1FG256I

The M1A3P400-1FG256I is a ProASIC3-series Flash FPGA offering a combination of programmable logic, embedded memory and a broad I/O complement in a compact 256‑LBGA package. As part of the ProASIC3/EL low-power flash FPGA family that incorporates Flash*Freeze technology, this device targets industrial embedded systems that require programmable logic with defined temperature and supply specifications.

Key silicon attributes include 9,216 logic elements (cells), approximately 55 Kbits of on-chip RAM, 178 user I/Os and a nominal logic capacity of 400,000 gates—delivered in a surface-mount 256‑LBGA (256‑FPBGA, 17×17) package.

Key Features

• Core Logic  9,216 logic elements (cells) providing a logic capacity of 400,000 gates for flexible implementation of custom logic and glue functions.
• Embedded Memory  Approximately 55 Kbits of total on-chip RAM (55,296 bits) to support small buffers, FIFOs and register files without external memory.
• I/O Resources  178 user I/O pins to support wide interfacing options for parallel and serial peripheral connections.
• Low-Power Flash Technology  Part of the ProASIC3/EL low-power flash FPGA family with Flash*Freeze technology for reduced power modes as described in the family datasheet.
• Power and Operating Range  Single-supply operation within 1.425 V to 1.575 V and specified operating temperature range of −40 °C to 100 °C, suitable for industrial temperature environments.
• Package and Mounting  Surface-mount 256‑LBGA package (supplier package: 256‑FPBGA, 17×17) for compact board-level integration.
• Compliance  RoHS compliant to support environmentally conscious manufacturing requirements.

Typical Applications

• Industrial Embedded Systems  Deploy programmable logic in industrial controllers and instrumentation where extended temperature support and a robust I/O count are required.
• Interface and Glue Logic  Implement protocol bridging, bus consolidation and custom interfacing using the device’s abundant I/Os and on-chip logic.
• Low-Power FPGA Designs  Leverage the ProASIC3/EL family’s low-power flash characteristics and Flash*Freeze capability for applications that benefit from reduced standby power.

Unique Advantages

• Well-defined industrial operating range: Specified −40 °C to 100 °C operation aligns the device with industrial-class deployments.
• High integration in a compact package: 9,216 logic elements and 178 I/Os packaged in a 256‑LBGA reduce board footprint and simplify routing.
• On-chip memory for reduced BOM: Approximately 55 Kbits of embedded RAM supports local buffering and control logic, minimizing external memory needs.
• Flash-based non-volatile configuration: ProASIC3/EL flash architecture enables in-system programmability without external configuration memory.
• Narrow supply window for predictable power design: 1.425 V to 1.575 V supply specification helps designers target predictable power rails and margins.
• RoHS compliant: Meets common lead-free manufacturing requirements for commercial and industrial production.

Why Choose M1A3P400-1FG256I?

The M1A3P400-1FG256I balances a substantial logic resource set and on-chip RAM with a significant I/O complement in a space-efficient 256‑LBGA package, making it suitable for industrial embedded designs that require programmable logic with defined temperature and supply constraints. Its inclusion in the ProASIC3/EL low-power flash FPGA family and support for Flash*Freeze technology provide designers with non-volatile configurability and low-power operation options.

This device is appropriate for customers seeking a flash-based FPGA with clear, verifiable specifications for logic density, memory, I/O count, package type and operating range—helpful for long-term designs where stability and predictable electrical/thermal behavior matter.

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