M1A3P400-1FGG256I
| Part Description |
ProASIC3 Field Programmable Gate Array (FPGA) IC 178 55296 256-LBGA |
|---|---|
| Quantity | 1,304 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 178 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 9216 | Number of Logic Elements/Cells | 9216 | ||
| Number of Gates | 400000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 55296 |
Overview of M1A3P400-1FGG256I – ProASIC3 Field Programmable Gate Array (FPGA) IC 178 55296 256-LBGA
The M1A3P400-1FGG256I is a ProASIC3 series flash-based FPGA offering reprogrammable, nonvolatile logic in a compact 256-LBGA package. It combines a low-voltage core architecture with a high I/O count and embedded memory to address designs where instant-on behavior, security, and low power are important.
Targeted at applications that require flexible, single-chip solutions, this device delivers 9,216 logic elements, approximately 0.055 Mbits of embedded memory, and 178 user I/Os while operating across an industrial temperature range and a low-voltage supply window.
Key Features
- Core and Logic 9,216 logic elements (LEs) and approximately 400,000 system gates provide the programmable fabric for control, glue logic, and custom digital functions.
- Embedded Memory Total on-chip RAM of 55,296 bits (approximately 0.055 Mbits) plus flash-based user nonvolatile memory for configuration retention.
- I/O and Voltage Flexibility 178 user I/Os with mixed-voltage operation (1.5V, 1.8V, 2.5V and 3.3V) and bank-selectable I/O voltages to interface with a variety of peripherals and I/O standards.
- Power and Supply Low-voltage core support with a specified supply range of 1.425 V to 1.575 V and architecture optimized for low-power, instant-on operation.
- Security and In-System Programming Supports in-system programming with on-chip 128-bit AES decryption (IEEE 1532–compliant) and FlashLock® functionality to protect FPGA contents.
- Performance Series-level performance characteristics include a 350 MHz system performance reference for timing-sensitive applications.
- Clocking Clock conditioning blocks and integrated PLL capability (series feature) allow configurable phase shift, multiply/divide, and external feedback for clock management.
- Package and Mounting 256-LBGA (supplier package 256-FPBGA, 17 × 17), surface-mount package suitable for compact board layouts.
- Temperature and Reliability Industrial-grade operation from −40 °C to 100 °C and RoHS-compliant construction for regulated production environments.
Typical Applications
- Portable and Battery-Powered Products Low-voltage core and instant-on behavior make the device suitable for portable designs and battery-backed systems where power efficiency and fast startup matter.
- Consumer and High-Volume Electronics Compact 256-LBGA packaging and reprogrammable Flash technology provide a single-chip solution for space-constrained, cost-sensitive consumer applications.
- Industrial Control and Automation Industrial temperature rating and mixed-voltage I/Os enable reliable interfacing and control functions across a wide operating range.
- Secure In-System Updates Built-in AES ISP and FlashLock® support secure configuration updates and protection of intellectual property in deployed systems.
Unique Advantages
- Reprogrammable, Nonvolatile Flash Retains programmed design when powered off and supports reprogramming for design updates without external configuration memory.
- High I/O Density 178 user I/Os with bank-selectable voltages simplify integration with mixed-voltage peripherals and reduce the need for level-shifting components.
- Low-Voltage, Low-Power Operation Core supply centered near 1.5 V and architecture designed for low power help reduce system power consumption in constrained designs.
- Security-Ready On-chip 128-bit AES decryption and FlashLock® provide mechanisms for secure in-field programming and content protection.
- Industrial Temperature Range Specified operation from −40 °C to 100 °C supports deployment in harsher environments and industrial applications.
- Compact BGA Package 256-LBGA (17 × 17) enables high-density PCB layouts while keeping a broad I/O count available for complex designs.
Why Choose M1A3P400-1FGG256I?
The M1A3P400-1FGG256I positions itself as a versatile ProASIC3 flash FPGA option that blends a substantial logic capacity (9,216 LEs) with a high I/O count and nonvolatile configuration. Its low-voltage core, security features, and industrial temperature rating make it well-suited to applications where reliability, power efficiency, and secure in-system updates are important.
This device is appropriate for engineers seeking a compact, reprogrammable single-chip solution that supports mixed-voltage I/O interfaces, offers built-in security for field updates, and fits in space-constrained board designs.
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