M1A3P400-1PQ208I

The M1A3P400-1PQ208I is a ProASIC3 flash-based FPGA from Microchip Technology designed for applications requiring reconfigurable logic in a compact surface-mount package. The device provides 400,000 gates and 9,216 logic elements, making it suitable for designs that need moderate logic density with integrated on-chip RAM and a broad I/O complement.

Built on the ProASIC3 family architecture with Flash*Freeze technology (as documented in the ProASIC3 series datasheet), this device targets industrial and embedded applications where controllable power behavior, non-volatile configuration and a wide operating temperature range are important.

Key Features

• Core & Logic 400,000 gates and 9,216 logic elements provide a reconfigurable fabric for implementing custom digital functions.
• Embedded Memory Approximately 0.055 Mbits of embedded RAM (55,296 bits) for local storage and buffering within user logic.
• I/O Density 151 general-purpose I/O pins to support multiple interfaces and peripheral connections on a single device.
• Non-volatile Flash Configuration ProASIC3 family flash-based architecture with Flash*Freeze technology (as documented in the family datasheet) for persistent configuration and low-power operational modes.
• Power Core supply voltage range of 1.425 V to 1.575 V for stable core operation.
• Package & Mounting 208-BFQFP package (supplier device package: 208‑PQFP, 28×28) in a surface-mount form factor for compact PCB integration.
• Temperature Range Industrial operating range from −40 °C to 100 °C to support deployment in demanding environments.
• RoHS Compliance Device is RoHS compliant.

Typical Applications

• Industrial Control Reconfigurable logic and ample I/O make the device suitable for control, monitoring and interface bridging in industrial equipment operating across a wide temperature range.
• Communications Equipment Use the FPGA fabric and 151 I/O to implement custom protocol handling, interface conversion and glue-logic in communications hardware.
• Data Center & Networking Employ the device for control-plane logic, I/O aggregation or custom preprocessing functions where non-volatile configuration and moderate logic density are needed.
• Aerospace & Defense Systems The ProASIC3 family architecture and flash-based configuration are documented in the family datasheet, making the device relevant for embedded processing and interface tasks in aerospace and defense systems where flash configuration is preferred.

Unique Advantages

• Reconfigurable Logic Density: 9,216 logic elements and 400,000 gates provide a balanced resource set for mid-density FPGA designs, reducing the need for multiple discrete logic devices.
• Non-volatile Flash Configuration: Flash-based ProASIC3 architecture allows persistent configuration without external configuration memory and supports documented low-power modes.
• Broad I/O Count: 151 I/O pins enable integration of multiple interfaces and peripherals on a single chip, simplifying board-level design.
• Industrial Temperature Rating: Rated for −40 °C to 100 °C operation to support deployment in temperature-challenging environments.
• Compact Surface-Mount Package: 208-BFQFP (28 × 28) package provides a space-efficient footprint for dense PCB layouts.
• Compliance and Reliability: RoHS compliance and Microchip Technology supply ensure traceability and lead-free manufacturing conformity.

Why Choose M1A3P400-1PQ208I?

The M1A3P400-1PQ208I positions itself as a versatile mid-density FPGA that combines reconfigurable logic, on-chip RAM and a high I/O count in a compact surface-mount package. Its flash-based ProASIC3 architecture with Flash*Freeze capability (as documented for the family) provides persistent configuration behavior desirable in embedded and industrial deployments.

This device is a practical selection for engineers and procurement teams seeking a reliable, industrial-grade FPGA for applications in industrial control, communications, data center subsystems and aerospace/defense embedded functions where temperature range, non-volatile configuration and a compact package are required.

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