M1A3P400-1PQ208

IC FPGA 151 I/O 208QFP
Part Description

ProASIC3 Field Programmable Gate Array (FPGA) IC 151 55296 208-BFQFP

Quantity 507 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 85°C
Package / Case208-BFQFPNumber of I/O151Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs9216Number of Logic Elements/Cells9216
Number of Gates400000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits55296

Overview of M1A3P400-1PQ208 – ProASIC3 Field Programmable Gate Array (FPGA) IC 151 55296 208-BFQFP

The M1A3P400-1PQ208 is a ProASIC3 flash-based Field Programmable Gate Array (FPGA) from Microchip Technology. It delivers a mid-density programmable logic resource set with a flash, low-power architecture that includes Flash*Freeze technology as described for the ProASIC3 family.

Designed for commercial-temperature applications, this device combines a substantial I/O count and on-chip memory with a compact 208-pin PQFP package for space-constrained board designs that require reconfigurable digital logic and interface flexibility.

Key Features

  • Logic Capacity  Provides 9,216 logic elements (9216 logic element cells) equivalent to approximately 400,000 gates for implementing custom digital logic and state machines.
  • Embedded Memory  Includes 55,296 bits of total on-chip RAM (approximately 0.055 Mbits) to support FIFOs, small buffers, and local data storage.
  • I/O Resources  Offers 151 general-purpose I/Os to interface with multiple peripherals and external devices from a single package.
  • Flash-Based, Low-Power Architecture  Part of the ProASIC3 family with Flash*Freeze technology as documented in the family datasheet, providing flash-based configuration and low-power characteristics.
  • Power Supply  Operates from a defined core voltage range of 1.425 V to 1.575 V for predictable power design and rail planning.
  • Package & Mounting  Supplied in a 208-BFQFP / 208-PQFP (28×28) package and intended for surface-mount assembly, enabling high pin-count connectivity in a compact footprint.
  • Operating Conditions & Grade  Commercial grade device rated for an operating temperature range of 0 °C to 85 °C.
  • Regulatory  RoHS compliant.

Typical Applications

  • Custom Digital Logic and Prototyping  Implement application-specific digital functions and iterative design changes using the device’s 9,216 logic elements and flash-based configuration.
  • Interface Bridging and Glue Logic  Use the 151 I/Os to consolidate peripheral interfaces and reduce external glue components on mixed-signal or multi-board systems.
  • Control and Sequencing  Deploy for embedded control, sequencing, and state-machine tasks where on-chip RAM and flexible I/O are required.
  • Medium-Density Data Path Processing  Leverage the combination of gates, logic elements, and on-chip memory for data routing, buffering, and protocol handling in compact systems.

Unique Advantages

  • Highly integrated logic resources: 9,216 logic elements and ~400,000 gates reduce the need for multiple discrete logic devices, simplifying board design.
  • Flash-based, low-power operation: ProASIC3 family Flash*Freeze technology provides a flash configuration approach that aligns with low-power design goals.
  • High I/O density in a compact package: 151 I/Os in a 208-pin PQFP (28×28) allow dense connectivity without a larger BGA footprint.
  • Predictable power rail requirements: Narrow core voltage range (1.425 V to 1.575 V) helps streamline power-supply design and sequencing.
  • Commercial temperature rating and RoHS compliance: Suited for standard commercial environments while meeting RoHS lead-free requirements.

Why Choose M1A3P400-1PQ208?

The M1A3P400-1PQ208 positions itself as a mid-density, flash-configured FPGA that balances logic capacity, I/O count, and on-chip memory in a compact 208-pin PQFP surface-mount package. Its flash-based ProASIC3 architecture and Flash*Freeze technology align with designs that prioritize reconfigurability and low-power behavior within a commercial-temperature envelope.

This device is suitable for designers who need a reliable, reprogrammable logic element with substantial I/O capability and documented vendor support. It delivers a scalable building block for systems requiring custom digital processing, interface consolidation, or control logic while keeping board area and component count under control.

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