M1A3P400-2FG144

The M1A3P400-2FG144 is a ProASIC3 Field Programmable Gate Array (FPGA) IC from Microchip Technology. It delivers a balance of programmable logic capacity, embedded memory, and flexible I/O in a compact 144‑LBGA package for surface‑mount applications.

With 9,216 logic elements, approximately 400,000 equivalent gates and 97 I/Os, this device is suited for embedded logic, interface bridging and control functions where a small, low‑voltage FPGA is required. The device supports single‑supply operation between 1.425 V and 1.575 V and operates over a commercial temperature range.

Key Features

• Logic Capacity — 9,216 logic elements providing approximately 400,000 equivalent gates for implementing combinational and sequential logic.
• Embedded Memory — Approximately 0.055 Mbits (55,296 bits) of on‑chip RAM for small buffers, FIFOs and state storage.
• I/O Count — 97 general‑purpose I/Os to support parallel interfaces, control lines and mixed signal connectivity at the board level.
• Low‑Voltage Core — Core supply range of 1.425 V to 1.575 V to match low‑voltage system domains.
• Package & Mounting — 144‑lead LBGA (supplier package: 144‑FPBGA, 13×13) in a surface‑mount form factor for compact board designs.
• Operating Temperature — Rated for commercial operation from 0 °C to 85 °C.
• Low‑Power Flash Technology — Based on the ProASIC3 family architecture with Flash technology referenced in the series datasheet for low‑power nonvolatile configuration.
• Regulatory Compliance — RoHS compliant for environmental regulatory requirements.

Typical Applications

• Custom control and glue logic — Implement board‑level timing, protocol adaptation and control functions using the device’s logic elements and abundant I/O.
• Interface bridging — Use the 97 I/Os and on‑chip memory for bus conversion, signal aggregation and protocol bridging on compact PCBs.
• Embedded system peripherals — Implement custom peripherals, state machines and small buffering within consumer and commercial electronic products.
• Prototyping and evaluation — Evaluate programmable logic partitioning and I/O strategies in development and proof‑of‑concept designs.

Unique Advantages

• Balanced logic and I/O mix: 9,216 logic elements and 97 I/Os provide a practical balance for glue logic, control and medium‑complexity designs.
• Compact board footprint: 144‑LBGA (13×13) package enables dense, surface‑mount implementations without sacrificing I/O count.
• Low‑voltage operation: Core supply range of 1.425–1.575 V supports integration into modern low‑voltage systems.
• On‑chip RAM for local buffering: Approximately 0.055 Mbits of embedded memory reduces external memory requirements for small data buffers.
• Nonvolatile configuration foundation: The ProASIC3 family references Flash configuration technology in the series datasheet, enabling nonvolatile programmable behavior.
• RoHS compliant: Meets lead‑free and restricted materials requirements for commercial product assembly.

Why Choose M1A3P400-2FG144?

The M1A3P400-2FG144 positions itself as a versatile mid‑range ProASIC3 FPGA offering a practical combination of logic density, I/O count and on‑chip memory in a compact 144‑LBGA surface‑mount package. Its low‑voltage core and RoHS compliance make it suitable for modern commercial electronic designs requiring programmable logic with nonvolatile configuration characteristics referenced in the ProASIC3 series documentation.

This device is well suited to engineers and procurement teams building embedded control, interface or prototyping solutions who need a reliable, compact FPGA with clear, verifiable specifications for logic capacity, supply voltage and operating temperature.

Request a quote or submit a pricing and availability inquiry to receive lead time and purchasing information for the M1A3P400-2FG144.