M1A3P400-2FGG144
| Part Description |
ProASIC3 Field Programmable Gate Array (FPGA) IC 97 55296 144-LBGA |
|---|---|
| Quantity | 919 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-FPBGA (13x13) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LBGA | Number of I/O | 97 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 9216 | Number of Logic Elements/Cells | 9216 | ||
| Number of Gates | 400000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 55296 |
Overview of M1A3P400-2FGG144 – ProASIC3 Field Programmable Gate Array (FPGA) IC, 97 I/O, 55.3 kbit RAM, 144-LBGA
The M1A3P400-2FGG144 is a ProASIC3 flash-based, reprogrammable FPGA packaged in a 144-LBGA (144-FPBGA, 13×13) surface-mount package. It combines nonvolatile configuration, moderate logic capacity and on-chip RAM to address applications that require low-power instant-on behavior and secure in-system programmability.
Designed for commercial-temperature deployments, this device targets high-volume consumer and portable applications as well as battery-backed systems where compact packaging, mixed-voltage I/O flexibility and secure updates are important.
Key Features
- Logic Capacity — 9,216 logic elements providing a synthesis-targetable fabric and approximately 400,000 system gates for mid-density designs.
- Embedded Memory — Total on-chip RAM of 55,296 bits (approximately 55.3 kbits) for FIFOs, small buffers and state storage.
- I/O and Mixed-Voltage Support — 97 user I/Os with bank-selectable voltages and support for single-ended standards across 1.5V, 1.8V, 2.5V and 3.3V domains for easy interfacing with modern peripherals.
- Reprogrammable Flash Technology — Nonvolatile, flash-based configuration that retains the programmed design when powered off and enables in-system reconfiguration.
- Secure In-System Programming (ISP) — On-chip AES-based decryption and FlashLock support for secure configuration updates via JTAG (IEEE 1532–compliant features described in the family datasheet).
- Low-Voltage Core — Core supply range of 1.425 V to 1.575 V (nominal 1.5 V) for low-power operation and compatibility with 1.5V-only systems.
- Clocking and Timing — Configurable clock-conditioning circuitry and PLL capabilities for flexible clock management (family-level clock features are documented in the ProASIC3 series datasheet).
- Package and Temperature — 144-LBGA (144-FPBGA, 13×13) surface-mount package; commercial operating temperature range 0 °C to 85 °C; RoHS compliant.
Typical Applications
- Portable and Battery-Backed Devices — Low core voltage, nonvolatile configuration and instant-on behavior make the device suitable for compact, battery-powered systems.
- Consumer Electronics — Use as glue logic, protocol bridging or custom peripheral control where mixed-voltage I/O and small- to mid-level logic density are required.
- Embedded Control and User Interfaces — Implement control state machines, display drivers, and input scan/state logic leveraging the on-chip RAM and 97 I/Os.
- Secure Field Updates — Systems requiring secure in-system firmware or configuration updates can utilize the device’s AES-based ISP and FlashLock security features.
Unique Advantages
- Reprogrammable Nonvolatile Configuration: Flash-based architecture retains designs without external configuration memory, simplifying power-up and system design.
- Secure ISP Workflow: On-chip AES decryption and FlashLock capabilities enable authenticated updates and protect IP during in-system programming.
- Flexible I/O Interfacing: 97 user I/Os with bank-selectable voltages support mixed-voltage systems and reduce the need for level-shifting components.
- Compact, Surface-Mount Package: 144-FPBGA (13×13) form factor supports compact board layouts and surface-mount assembly for space-constrained products.
- Low-Power Core Supply: 1.425 V to 1.575 V core supply reduces power consumption for energy-sensitive designs.
- Commercial Temperature Rating: Specified 0 °C to 85 °C operation for standard commercial deployments and applications.
Why Choose M1A3P400-2FGG144?
The M1A3P400-2FGG144 positions itself as a mid-density, flash-configurable FPGA that balances logic capacity, on-chip RAM and secure reprogrammability in a compact 144-LBGA package. Its support for mixed-voltage I/Os, on-chip security features and low-voltage core make it well suited to consumer, portable and battery-backed applications where instant-on behavior and field-update security are priorities.
For designers seeking a RoHS-compliant, surface-mount FPGA with 9,216 logic elements, roughly 55.3 kbits of embedded RAM and 97 I/Os, this ProASIC3 device provides a pragmatic, reprogrammable building block that integrates configuration retention, flexible interfacing and secure ISP capability.
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