M1A3P400-2FGG144

IC FPGA 97 I/O 144FBGA
Part Description

ProASIC3 Field Programmable Gate Array (FPGA) IC 97 55296 144-LBGA

Quantity 919 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package144-FPBGA (13x13)GradeCommercialOperating Temperature0°C – 85°C
Package / Case144-LBGANumber of I/O97Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs9216Number of Logic Elements/Cells9216
Number of Gates400000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits55296

Overview of M1A3P400-2FGG144 – ProASIC3 Field Programmable Gate Array (FPGA) IC, 97 I/O, 55.3 kbit RAM, 144-LBGA

The M1A3P400-2FGG144 is a ProASIC3 flash-based, reprogrammable FPGA packaged in a 144-LBGA (144-FPBGA, 13×13) surface-mount package. It combines nonvolatile configuration, moderate logic capacity and on-chip RAM to address applications that require low-power instant-on behavior and secure in-system programmability.

Designed for commercial-temperature deployments, this device targets high-volume consumer and portable applications as well as battery-backed systems where compact packaging, mixed-voltage I/O flexibility and secure updates are important.

Key Features

  • Logic Capacity — 9,216 logic elements providing a synthesis-targetable fabric and approximately 400,000 system gates for mid-density designs.
  • Embedded Memory — Total on-chip RAM of 55,296 bits (approximately 55.3 kbits) for FIFOs, small buffers and state storage.
  • I/O and Mixed-Voltage Support — 97 user I/Os with bank-selectable voltages and support for single-ended standards across 1.5V, 1.8V, 2.5V and 3.3V domains for easy interfacing with modern peripherals.
  • Reprogrammable Flash Technology — Nonvolatile, flash-based configuration that retains the programmed design when powered off and enables in-system reconfiguration.
  • Secure In-System Programming (ISP) — On-chip AES-based decryption and FlashLock support for secure configuration updates via JTAG (IEEE 1532–compliant features described in the family datasheet).
  • Low-Voltage Core — Core supply range of 1.425 V to 1.575 V (nominal 1.5 V) for low-power operation and compatibility with 1.5V-only systems.
  • Clocking and Timing — Configurable clock-conditioning circuitry and PLL capabilities for flexible clock management (family-level clock features are documented in the ProASIC3 series datasheet).
  • Package and Temperature — 144-LBGA (144-FPBGA, 13×13) surface-mount package; commercial operating temperature range 0 °C to 85 °C; RoHS compliant.

Typical Applications

  • Portable and Battery-Backed Devices — Low core voltage, nonvolatile configuration and instant-on behavior make the device suitable for compact, battery-powered systems.
  • Consumer Electronics — Use as glue logic, protocol bridging or custom peripheral control where mixed-voltage I/O and small- to mid-level logic density are required.
  • Embedded Control and User Interfaces — Implement control state machines, display drivers, and input scan/state logic leveraging the on-chip RAM and 97 I/Os.
  • Secure Field Updates — Systems requiring secure in-system firmware or configuration updates can utilize the device’s AES-based ISP and FlashLock security features.

Unique Advantages

  • Reprogrammable Nonvolatile Configuration: Flash-based architecture retains designs without external configuration memory, simplifying power-up and system design.
  • Secure ISP Workflow: On-chip AES decryption and FlashLock capabilities enable authenticated updates and protect IP during in-system programming.
  • Flexible I/O Interfacing: 97 user I/Os with bank-selectable voltages support mixed-voltage systems and reduce the need for level-shifting components.
  • Compact, Surface-Mount Package: 144-FPBGA (13×13) form factor supports compact board layouts and surface-mount assembly for space-constrained products.
  • Low-Power Core Supply: 1.425 V to 1.575 V core supply reduces power consumption for energy-sensitive designs.
  • Commercial Temperature Rating: Specified 0 °C to 85 °C operation for standard commercial deployments and applications.

Why Choose M1A3P400-2FGG144?

The M1A3P400-2FGG144 positions itself as a mid-density, flash-configurable FPGA that balances logic capacity, on-chip RAM and secure reprogrammability in a compact 144-LBGA package. Its support for mixed-voltage I/Os, on-chip security features and low-voltage core make it well suited to consumer, portable and battery-backed applications where instant-on behavior and field-update security are priorities.

For designers seeking a RoHS-compliant, surface-mount FPGA with 9,216 logic elements, roughly 55.3 kbits of embedded RAM and 97 I/Os, this ProASIC3 device provides a pragmatic, reprogrammable building block that integrates configuration retention, flexible interfacing and secure ISP capability.

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