M1A3P400-2FGG256I

IC FPGA 178 I/O 256FBGA
Part Description

ProASIC3 Field Programmable Gate Array (FPGA) IC 178 55296 256-LBGA

Quantity 643 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LBGANumber of I/O178Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs9216Number of Logic Elements/Cells9216
Number of Gates400000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits55296

Overview of M1A3P400-2FGG256I – ProASIC3 Field Programmable Gate Array (FPGA) IC 178 55296 256-LBGA

The M1A3P400-2FGG256I is a ProASIC3 flash-based FPGA offering a balance of logic capacity, on-chip memory, and high I/O density in a compact 256-LBGA package. It combines reprogrammable, nonvolatile flash technology with system-oriented features aimed at industrial and embedded designs that require instant-on behavior, low power, and on-chip security.

Targeted use cases include industrial control, communications and instrumentation where a single-chip, reprogrammable FPGA with robust I/O and temperature range is required. The device delivers a combination of logic resources, embedded RAM, and a high pin count to simplify system integration.

Key Features

  • Logic Capacity — 9,216 logic elements (9216) and approximately 400,000 system gates provide programmable fabric for combinational and sequential logic implementations.
  • Embedded Memory — Total on-chip RAM of 55,296 bits (approximately 55.3 kbits) for small buffers, FIFOs, and state storage.
  • High I/O Density — 178 user I/Os to support parallel interfaces, multiple I/O banks, and high-pin-count system requirements.
  • Package and Mounting — 256-LBGA (supplier package: 256-FPBGA 17×17) with surface-mount construction suitable for compact board designs.
  • Power Supply — Core supply range 1.425 V to 1.575 V to match low-voltage system cores.
  • Industrial Temperature Range — Specified operation from −40 °C to 100 °C for demanding environmental conditions.
  • Nonvolatile Flash Technology — Flash-based CMOS architecture enables reprogrammable, single-chip solutions that retain the programmed design when powered off.
  • Security and In-System Programming — On-chip 128-bit AES decryption for JTAG-based ISP and FlashLock security designed to protect FPGA contents.
  • Performance and Clocking — Family-level routing and clocking features (including configurable clock conditioning blocks and PLL capabilities) support high-performance system clocks and timing management.
  • Standards and Compliance — RoHS compliant.

Typical Applications

  • Industrial Control — Implement motor control logic, sensor aggregation, and deterministic control paths using the device’s logic elements and wide operating temperature range.
  • Communications and Networking — Use high I/O count and programmable fabric for protocol bridging, parallel interfaces, and custom packet processing functions.
  • Instrumentation and Test Equipment — Leverage on-chip memory and flexible I/O for data capture, buffering, and control logic in measurement systems.
  • Embedded System Integration — Replace discrete glue logic and reduce BOM by consolidating interface logic, timing control, and small state machines into a single reprogrammable device.

Unique Advantages

  • Reprogrammable, Nonvolatile Flash: Retains configuration when powered off, enabling instant-on behavior and field reprogramming without external configuration memory.
  • On-chip Security for ISP: Built-in 128-bit AES decryption and FlashLock features protect intellectual property and enable secure in-system programming via JTAG.
  • High I/O Count in a Compact Package: 178 I/Os in a 256-LBGA footprint reduce board space while enabling multiple parallel interfaces and bank-selectable voltages.
  • Industrial Temperature Capability: Operating range from −40 °C to 100 °C supports deployment in harsh or uncontrolled environments.
  • Low-Voltage Core Support: Narrow core-supply window (1.425 V to 1.575 V) aligns with low-power system designs.
  • RoHS Compliant: Meets environmental requirements for modern manufacturing and supply chains.

Why Choose M1A3P400-2FGG256I?

The M1A3P400-2FGG256I is positioned for designers who need a reprogrammable, nonvolatile FPGA with a high I/O count, robust logic capacity, and an industrial temperature range. Its flash-based architecture and on-chip security features simplify system design by eliminating separate configuration memory while enabling secure in-system updates.

This device is well suited for embedded and industrial applications that require a compact package, reliable operation across temperature extremes, and integrated programmable resources to reduce BOM and accelerate time to market.

Request a quote or submit an inquiry to discuss pricing, availability, and how the M1A3P400-2FGG256I can be integrated into your next design.

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