M1A3P400-2FGG256I
| Part Description |
ProASIC3 Field Programmable Gate Array (FPGA) IC 178 55296 256-LBGA |
|---|---|
| Quantity | 643 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 178 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 9216 | Number of Logic Elements/Cells | 9216 | ||
| Number of Gates | 400000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 55296 |
Overview of M1A3P400-2FGG256I – ProASIC3 Field Programmable Gate Array (FPGA) IC 178 55296 256-LBGA
The M1A3P400-2FGG256I is a ProASIC3 flash-based FPGA offering a balance of logic capacity, on-chip memory, and high I/O density in a compact 256-LBGA package. It combines reprogrammable, nonvolatile flash technology with system-oriented features aimed at industrial and embedded designs that require instant-on behavior, low power, and on-chip security.
Targeted use cases include industrial control, communications and instrumentation where a single-chip, reprogrammable FPGA with robust I/O and temperature range is required. The device delivers a combination of logic resources, embedded RAM, and a high pin count to simplify system integration.
Key Features
- Logic Capacity — 9,216 logic elements (9216) and approximately 400,000 system gates provide programmable fabric for combinational and sequential logic implementations.
- Embedded Memory — Total on-chip RAM of 55,296 bits (approximately 55.3 kbits) for small buffers, FIFOs, and state storage.
- High I/O Density — 178 user I/Os to support parallel interfaces, multiple I/O banks, and high-pin-count system requirements.
- Package and Mounting — 256-LBGA (supplier package: 256-FPBGA 17×17) with surface-mount construction suitable for compact board designs.
- Power Supply — Core supply range 1.425 V to 1.575 V to match low-voltage system cores.
- Industrial Temperature Range — Specified operation from −40 °C to 100 °C for demanding environmental conditions.
- Nonvolatile Flash Technology — Flash-based CMOS architecture enables reprogrammable, single-chip solutions that retain the programmed design when powered off.
- Security and In-System Programming — On-chip 128-bit AES decryption for JTAG-based ISP and FlashLock security designed to protect FPGA contents.
- Performance and Clocking — Family-level routing and clocking features (including configurable clock conditioning blocks and PLL capabilities) support high-performance system clocks and timing management.
- Standards and Compliance — RoHS compliant.
Typical Applications
- Industrial Control — Implement motor control logic, sensor aggregation, and deterministic control paths using the device’s logic elements and wide operating temperature range.
- Communications and Networking — Use high I/O count and programmable fabric for protocol bridging, parallel interfaces, and custom packet processing functions.
- Instrumentation and Test Equipment — Leverage on-chip memory and flexible I/O for data capture, buffering, and control logic in measurement systems.
- Embedded System Integration — Replace discrete glue logic and reduce BOM by consolidating interface logic, timing control, and small state machines into a single reprogrammable device.
Unique Advantages
- Reprogrammable, Nonvolatile Flash: Retains configuration when powered off, enabling instant-on behavior and field reprogramming without external configuration memory.
- On-chip Security for ISP: Built-in 128-bit AES decryption and FlashLock features protect intellectual property and enable secure in-system programming via JTAG.
- High I/O Count in a Compact Package: 178 I/Os in a 256-LBGA footprint reduce board space while enabling multiple parallel interfaces and bank-selectable voltages.
- Industrial Temperature Capability: Operating range from −40 °C to 100 °C supports deployment in harsh or uncontrolled environments.
- Low-Voltage Core Support: Narrow core-supply window (1.425 V to 1.575 V) aligns with low-power system designs.
- RoHS Compliant: Meets environmental requirements for modern manufacturing and supply chains.
Why Choose M1A3P400-2FGG256I?
The M1A3P400-2FGG256I is positioned for designers who need a reprogrammable, nonvolatile FPGA with a high I/O count, robust logic capacity, and an industrial temperature range. Its flash-based architecture and on-chip security features simplify system design by eliminating separate configuration memory while enabling secure in-system updates.
This device is well suited for embedded and industrial applications that require a compact package, reliable operation across temperature extremes, and integrated programmable resources to reduce BOM and accelerate time to market.
Request a quote or submit an inquiry to discuss pricing, availability, and how the M1A3P400-2FGG256I can be integrated into your next design.

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