M1A3P400-2PQ208I

The M1A3P400-2PQ208I is a ProASIC3/EL flash-based FPGA offering 400,000 gates, 9,216 logic elements and approximately 0.055 Mbits (≈55 kbits) of on-chip RAM. It implements a low-power flash FPGA architecture with Flash*Freeze technology as described in the product family datasheet.

Designed for industrial applications, this surface-mount device combines a high I/O count (151 pins) and a compact 208-BFQFP package to support space-efficient, robust embedded designs that require non-volatile flash configuration and wide operating temperature range.

Key Features

• Core Capacity  Provides 400,000 gates and 9,216 logic elements to implement complex digital logic and control functions.
• Embedded Memory  Includes approximately 0.055 Mbits (≈55 kbits) of total on-chip RAM for buffering, state storage, and small LUT-based memories.
• I/O and Connectivity  151 general-purpose I/O pins support flexible system interfacing and peripheral connectivity in a single-package solution.
• Flash-Based Configuration  Flash configuration with Flash*Freeze technology (per family datasheet) enables non-volatile operation and low-power configuration/retention modes.
• Power Supply  Operates from a core supply range of 1.425 V to 1.575 V to match system power domains requiring lower-voltage FPGA cores.
• Package & Mounting  208-BFQFP (supplier device package: 208-PQFP, 28×28) in a surface-mount form factor for PCB population and automated assembly.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet demanding environmental conditions.
• RoHS Compliant  Manufactured in compliance with RoHS requirements.

Typical Applications

• Industrial Control & Automation  Use as centralized logic and I/O aggregation for motor control, PLC functions and sensor interfacing where industrial temperature and non-volatile configuration are required.
• Communications Equipment  Implement protocol bridging, packet handling, and custom logic in networking or telecom gear leveraging the device’s gate density and I/O resources.
• Aerospace & Defense Systems  Suitable for embedded control, interface logic and secure boot architectures consistent with low-power flash FPGAs described in the ProASIC3/EL family documentation.
• Data Center & Storage  Deploy for control-plane logic, custom I/O handling, or system monitoring functions that benefit from non-volatile configuration and compact packaging.

Unique Advantages

• Non-volatile Flash Configuration: Flash-based configuration with Flash*Freeze technology enables persistent programming and low-power retention capability as part of the ProASIC3/EL family feature set.
• Balanced Capacity and I/O: 400K gates combined with 151 I/Os and 9,216 logic elements provides a practical balance of logic density and external interfacing for mid-range embedded designs.
• Compact, Surface-Mount Package: 208-BFQFP (28×28 PQFP footprint) simplifies board layout for space-constrained applications while supporting automated assembly.
• Industrial Temperature Range: Rated −40 °C to 100 °C to support harsh-environment deployment without additional thermal qualification claims beyond the stated rating.
• Tight Core Voltage Window: Core supply range of 1.425 V–1.575 V supports designs with specific low-voltage power domains and predictable power sequencing.
• Regulatory Compliance: RoHS-compliant manufacturing supports environmental and supply-chain requirements.

Why Choose M1A3P400-2PQ208I?

The M1A3P400-2PQ208I is positioned for engineers who need a flash-configured FPGA with mid-range logic density, substantial I/O, and industrial temperature capability in a compact surface-mount package. Its combination of 400K gates, 9,216 logic elements and on-chip RAM provides the resources to implement control, interfacing and custom logic without external configuration memory.

This device is appropriate for teams targeting industrial, communications, aerospace/defense, or data center control functions that require non-volatile configuration and stable operation across a broad temperature range. Documentation referenced in the product family datasheet supports integration and design verification.

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