M1A3P400-2PQ208

The M1A3P400-2PQ208 is a ProASIC3 family field-programmable gate array (FPGA) in a 208-BFQFP package from Microchip Technology. It provides a flash-based FPGA architecture with on-chip logic, RAM and I/O resources suitable for configurable digital designs.

Designed for commercial-grade applications, this device combines 9216 logic elements, approximately 55,296 bits of on-chip RAM and up to 151 user I/O to support a wide range of configurable logic functions while operating from a 1.425 V to 1.575 V supply.

Key Features

• Logic Capacity — 9216 logic elements (cells) to implement combinational and sequential logic functions.
• On‑chip Memory — Total of 55,296 bits of embedded RAM for small buffering, FIFOs and state storage.
• Gate Equivalent — Approximately 400,000 gates of logic capacity for mapping complex designs.
• I/O Resources — 151 general-purpose user I/O pins to interface with external peripherals and signaling requirements.
• Power Supply — Core supply range from 1.425 V to 1.575 V for stable operation within specified voltage window.
• Package & Mounting — Supplied in a 208-BFQFP (208-PQFP 28×28) package, surface-mountable for standard PCB assembly.
• Operating Temperature — Commercial-grade temperature range from 0 °C to 85 °C.
• Flash-based Technology — Part of the ProASIC3 family with Flash*Freeze technology indicated in the ProASIC3/EL series documentation.
• RoHS Compliant — Device meets RoHS environmental compliance.

Typical Applications

• Custom Digital Logic — Implement glue logic, protocol bridges or custom state machines using 9216 logic elements and 151 I/O pins.
• Embedded Control — On-chip RAM (≈55,296 bits) and ample I/O enable control functions and small data buffering for embedded systems operating within the 0 °C to 85 °C range.
• Interface Conversion — Use the 151 user I/Os for signal adaptation and protocol interfacing between boards and peripherals.

Unique Advantages

• Balanced Logic and Memory — 9216 logic elements combined with ~55,296 bits of RAM delivers a practical mix for mid-density FPGA implementations.
• Compact Surface-Mount Package — 208-BFQFP packaging (28×28 PQFP footprint) provides a high-pin-count option in a standard SMT form factor.
• Defined Commercial Temperature Range — Rated for 0 °C to 85 °C to match common commercial embedded applications.
• Controlled Core Voltage — Narrow core supply window (1.425 V to 1.575 V) simplifies power-supply planning for consistent device performance.
• RoHS Compliance — Meets environmental regulations for lead-free assembly processes.
• Flash-based ProASIC3 Architecture — Leverages the ProASIC3 family architecture and associated features such as Flash*Freeze technology as documented for the series.

Why Choose M1A3P400-2PQ208?

The M1A3P400-2PQ208 positions itself as a mid-density, flash-based FPGA option for commercial embedded designs that require a balance of logic capacity, on-chip memory and a substantial number of I/O pins in a compact surface-mount package. Its defined voltage and temperature ranges make it straightforward to integrate into standard commercial boards and assemblies.

This device is well suited to engineers and designers seeking a configurable logic device with clear, verifiable specifications—including 9216 logic elements, approximately 55,296 bits of on-chip RAM, 151 I/O and a 208-BFQFP package—backed by Microchip’s ProASIC3 family documentation and Flash-based architecture.

Request a quote or submit an inquiry for pricing and availability to move your design forward with the M1A3P400-2PQ208.