M1A3P400-FG144

The M1A3P400-FG144 is a ProASIC3 series flash-based FPGA from Microchip Technology. It provides reprogrammable logic in a compact surface-mount 144‑LBGA package, delivering a balance of logic density, I/O count and on-chip memory for commercial embedded designs.

Engineered for applications that require moderate gate density and flexible I/O, the device leverages the ProASIC3 family architecture and includes features described in the series documentation such as Flash*Freeze technology for low-power operation.

Key Features

• Core Logic  Approximately 9,216 logic elements (cells) corresponding to a logic capacity of 400,000 gates for implementing custom digital functions.
• Embedded Memory  Approximately 0.055 Mbits of on-chip RAM (55,296 bits) for local buffering and state storage.
• I/O  97 user I/O pins to support multiple peripheral interfaces and signal connections.
• Power  Low-voltage core supply specified at 1.425 V to 1.575 V for the FPGA core domain.
• Package & Mounting  Surface-mount 144‑LBGA package; supplier device package listed as 144‑FPBGA (13×13) for compact board-level integration.
• Operating Range & Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Low‑Power Family Features  Series documentation references Flash*Freeze technology for reduced-power modes and configuration retention.
• Regulatory Compliance  RoHS compliant.

Typical Applications

• Embedded Control  Implement custom control logic and finite-state machines using the device's 9,216 logic elements and local RAM within commercial embedded systems.
• I/O Expansion and Protocol Bridging  Use the 97 I/O pins to bridge peripherals and expand interface capability on compact PCBs.
• Prototyping and Low‑Power Designs  Leverage the ProASIC3 family architecture and documented Flash*Freeze features for development of low-power or reprogrammable prototypes.

Unique Advantages

• Moderate Logic Density:  9,216 logic elements and 400,000 gates provide capability for medium-complexity designs without excessive board real estate.
• Compact, Surface‑Mount Package:  144‑LBGA (144‑FPBGA, 13×13) enables high-density board layouts and reliable solder mounting.
• Balanced I/O Count:  97 available I/O pins support multiple peripheral connections while keeping package size constrained.
• Low‑Voltage Operation:  Core supply specified between 1.425 V and 1.575 V for designs targeting reduced power domains.
• Commercial Temperature Grade:  Rated for 0 °C to 85 °C, suitable for a wide range of commercial electronics applications.
• RoHS Compliant:  Meets RoHS requirements for regulated substances.

Why Choose M1A3P400-FG144?

The M1A3P400-FG144 combines a practical logic element count, on-chip memory and a substantial I/O complement in a compact 144‑LBGA footprint, making it well suited to commercial embedded designs that need reprogrammable logic with moderate complexity. Its low-voltage core and documented ProASIC3 family low-power features provide options for power-conscious designs.

Backed by Microchip Technology product documentation for the ProASIC3 family, this device is a fit for engineers and procurement teams seeking a commercially graded, RoHS‑compliant flash FPGA with clear electrical and mechanical specifications.

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