M1A3P400-FG256

The M1A3P400-FG256 is a ProASIC3 Field Programmable Gate Array (FPGA) from Microchip Technology, offering 9,216 logic elements and approximately 55 Kbits (55,296 bits) of on-chip RAM. The device provides 178 user I/O in a compact 256-LBGA (256-FPBGA, 17 × 17) surface-mount package and implements up to 400,000 gates of logic.

Designed for commercial-grade applications, the device operates from a core supply range of 1.425 V to 1.575 V and across an operating temperature of 0 °C to 85 °C. The ProASIC3 family is based on a flash-configured architecture and includes Flash*Freeze Technology as described in the ProASIC3/EL datasheet, enabling nonvolatile configuration and low-power operation characteristics.

Key Features

• Logic Capacity — 9,216 logic elements and a 400,000-gate equivalent for implementing custom digital designs and state machines.
• Embedded Memory — Approximately 55 Kbits (55,296 bits) of on-chip RAM for data buffering, small frame storage, and local state.
• I/O Resources — 178 user I/O pins to support multiple peripherals and external interfaces.
• Power and Configuration — Core voltage supply range of 1.425 V to 1.575 V; flash-configured architecture with Flash*Freeze Technology per the ProASIC3/EL datasheet.
• Package and Mounting — 256-LBGA (supplier device package: 256-FPBGA 17×17) in a surface-mount form factor for compact PCB integration.
• Operating Range and Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Custom Digital Logic — Implement finite-state machines, protocol engines, and custom combinational/sequential logic using 9,216 logic elements and up to 400,000 gates.
• On-chip Data Buffering — Use approximately 55 Kbits of embedded RAM for small buffers, FIFOs, and local data storage without external memory.
• Interface Bridging and Glue Logic — 178 I/O pins enable protocol adaptation, signal conditioning, and integration between multiple subsystems on a compact board footprint.

Unique Advantages

• Flexible Logic Density: 9,216 logic elements and 400,000 gate equivalent capacity reduce the need for multiple discrete logic ICs.
• Compact, High-I/O Package: 178 I/O in a 256-LBGA (17 × 17) package simplifies board routing while conserving PCB area.
• On-chip Memory: Approximately 55 Kbits of embedded RAM lowers dependency on external memory for small-data tasks.
• Flash-based Configuration: ProASIC3 flash architecture with Flash*Freeze Technology (per datasheet) provides nonvolatile configuration and supports low-power states.
• Commercial Temperature Range: Rated for 0 °C to 85 °C to match standard commercial application environments.
• Regulatory Compliance: RoHS compliant for global commercial production requirements.

Why Choose M1A3P400-FG256?

The M1A3P400-FG256 balances moderate logic capacity, embedded memory, and a high I/O count in a compact 256-LBGA package, making it well suited for commercial embedded designs that require configurable logic and flexible interfacing. With a defined core voltage range and commercial temperature rating, the device supports stable power design and typical commercial operating environments.

Backed by Microchip’s ProASIC3 flash-configured architecture and documented Flash*Freeze Technology, the part provides a nonvolatile, reconfigurable platform with on-chip memory resources—helpful for consolidating discrete logic and simplifying BOMs in many programmable-logic applications.

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