M1A3P400-FGG144I

The M1A3P400-FGG144I is a ProASIC3 series reprogrammable, nonvolatile Flash-based FPGA optimized for embedded logic integration and system consolidation. It delivers a substantial logic capacity with 400,000 equivalent gates and 9,216 logic elements, combined with on-chip embedded memory and a high I/O count for demanding board-level implementations.

Designed for industrial applications and volume designs, this device offers low-power operation, mixed-voltage I/O flexibility, and security/support for in-system programming, making it suitable for consumer, portable, and industrial designs that require retained configuration and robust field programmability.

Key Features

• Logic Capacity — 400,000 system gates and 9,216 logic elements (cells) provide substantial programmable logic for complex control, glue logic, and custom datapaths.
• Embedded Memory — 55,296 total RAM bits of on-chip memory to implement FIFOs, small buffers, and state machines without external RAM.
• I/O Density and Flexibility — 97 user I/Os with support for mixed-voltage operation and bank-selectable I/O voltages to interface directly with multiple voltage domains.
• Package and Mounting — 144-LBGA package (supplier package: 144-FPBGA, 13×13) in a surface-mount form factor for compact PCB layouts.
• Power and Core Voltage — Core supply operating range specified at 1.425 V to 1.575 V, supporting low-power system designs.
• Operating Range and Grade — Industrial-grade device with an operating temperature range of −40 °C to 100 °C suitable for harsh environments.
• Nonvolatile, Reprogrammable Flash Architecture — Flash-based design retains programmed configuration when powered off and supports in-system reprogramming.
• In-System Programming and Security — Series-level capabilities include ISP functionality and on-chip AES-based decryption to protect configuration data during programming.
• Environmental Compliance — RoHS-compliant manufacturing status.

Typical Applications

• Industrial Control and Automation — Implements custom control logic, I/O aggregation, and state-machine functions within industrial systems operating across the industrial temperature range.
• Portable and Battery-Backed Devices — Flash nonvolatile configuration and low-power core voltage support designs where instant-on and retained configuration are important.
• Consumer Electronics — Consolidates glue logic, peripheral interfaces, and custom peripherals in compact, surface-mount packages for consumer products.
• ASIC/ASSP Replacement and Prototyping — Reprogrammable Flash architecture provides a single-chip alternative to ASICs and ASSPs for faster time to market and iterative development.

Unique Advantages

• Significant Logic Density: 400k gates and 9,216 logic elements allow integration of complex logic functions and reduce the need for multiple discrete devices.
• On-Chip Memory Resources: Approximately 55 kbits of embedded RAM minimizes external memory dependency for small buffers and state storage.
• Mixed-Voltage I/O Support: Bank-selectable I/O voltages enable direct interfacing to multiple subsystem voltage levels without external level shifters.
• Nonvolatile, Reprogrammable Flash: Retains configuration when powered off and supports in-field updates, simplifying maintenance and upgrades.
• Industrial Temperature Rating: −40 °C to 100 °C operation supports deployment in harsh and temperature-variable environments.
• RoHS-Compliant Manufacturing: Meets environmental compliance requirements for modern electronics production.

Why Choose M1A3P400-FGG144I?

The M1A3P400-FGG144I is positioned for designers who need a robust, industrial-grade FPGA with a balance of logic capacity, on-chip memory, and a high I/O count in a compact BGA package. Its Flash-based, reprogrammable architecture provides retained configuration and in-system programmability for devices that must be updated in the field or require instant-on behavior.

With clear electrical and thermal specifications, package density suitable for two-layer or compact PCBs, and security-oriented programming features at the series level, this device is well suited to applications that demand integration, low power, and long-term maintainability.

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