M1A3P400-PQ208I
| Part Description |
ProASIC3 Field Programmable Gate Array (FPGA) IC 151 55296 208-BFQFP |
|---|---|
| Quantity | 183 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 151 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 9216 | Number of Logic Elements/Cells | 9216 | ||
| Number of Gates | 400000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 55296 |
Overview of M1A3P400-PQ208I – ProASIC3 Field Programmable Gate Array (FPGA) IC 151 55296 208-BFQFP
The M1A3P400-PQ208I is a ProASIC3 series low-power flash FPGA from Microchip Technology, delivered in a 208-pin BFQFP surface-mount package. It provides a mid-range programmable logic solution with flash-based configuration and Flash*Freeze technology intended for industrial applications and markets such as aerospace & defense, communications, data center and industrial systems.
Designed for integration into embedded systems, the device offers a balance of logic density, on-chip memory and I/O capacity while operating across a defined supply and industrial temperature range suitable for robust designs.
Key Features
- Core Logic — 9,216 logic elements (cells) providing approximately 400,000 gates for implementing combinational and sequential logic functions.
- Embedded Memory — 55,296 bits of on-chip RAM (approximately 0.055 Mbits of embedded memory) for local buffering and storage.
- I/O Capacity — 151 user I/O pins to support a wide range of peripheral interfaces and board-level signal routing.
- Low-Power, Flash-Based Configuration — Flash configuration with Flash*Freeze technology as described in the ProASIC3/EL series for reduced standby power and non-volatile configuration retention.
- Power Supply — Precise core voltage range of 1.425 V to 1.575 V to match system power rails and ensure stable operation.
- Package and Mounting — 208-BFQFP package (supplier device package: 208-PQFP, 28 × 28 mm) in a surface-mount form factor for standard PCB assembly.
- Operating Range — Industrial-grade operating temperature from −40 °C to 100 °C for deployment in demanding environments.
- Density Metric — Approximately 400,000 gates to support moderate-complexity logic integration on a single device.
Typical Applications
- Aerospace & Defense systems — Reconfigurable logic in avionics and defense electronics where flash-based, non-volatile configuration and industrial temperature operation are required.
- Communications equipment — Custom protocol processing, interface bridging and glue logic that benefit from the device’s I/O count and local RAM.
- Data center and infrastructure — Control, monitoring and peripheral interface functions in equipment racks and network appliances.
- Industrial controls — Embedded control logic, sensor interfacing and real-time signal routing in industrial automation and instrumentation.
Unique Advantages
- Flash non-volatile configuration: Flash-based FPGA architecture retains configuration without external memory, simplifying system boot and security considerations.
- Low standby power with Flash*Freeze: Flash*Freeze technology reduces power draw in standby modes, helping lower overall system power consumption.
- Balanced logic and memory resources: 9,216 logic elements combined with 55,296 bits of on-chip RAM provide a compact platform for mid-complexity designs.
- High I/O integration: 151 I/O pins allow direct connection to multiple peripherals and board-level signals, reducing the need for external glue logic.
- Industrial temperature rating: Operation from −40 °C to 100 °C supports deployment in harsh or temperature-variable environments.
- Standard surface-mount package: 208-BFQFP (208-PQFP, 28 × 28 mm) enables straightforward PCB layout and assembly with common manufacturing processes.
Why Choose M1A3P400-PQ208I?
The M1A3P400-PQ208I positions itself as a reliable, mid-density flash FPGA option within the ProASIC3 family from Microchip Technology. Its combination of approximately 9,216 logic elements, on-chip RAM, and 151 I/Os makes it suitable for engineers who need reconfigurable logic with non-volatile configuration in industrial-temperature environments.
Choose this device when your design requires flash-based configuration, controlled core voltage operation, and a standard 208-pin surface-mount package—offering a balance of integration, reconfigurability and deployment flexibility for systems in aerospace & defense, communications, data center and industrial markets.
Request a quote or contact sales to discuss pricing, lead times and availability for the M1A3P400-PQ208I.

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