M1A3P400-PQG208I

IC FPGA 151 I/O 208QFP
Part Description

ProASIC3 Field Programmable Gate Array (FPGA) IC 151 55296 208-BFQFP

Quantity 413 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time14 Weeks
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case208-BFQFPNumber of I/O151Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs9216Number of Logic Elements/Cells9216
Number of Gates400000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits55296

Overview of M1A3P400-PQG208I – ProASIC3 FPGA, 151 I/Os, 208-BFQFP

The M1A3P400-PQG208I is a ProASIC3 family Field Programmable Gate Array (FPGA) IC from Microchip Technology. It delivers a reprogrammable, nonvolatile FPGA fabric with 400,000 system gates and approximately 9,216 logic elements, targeted at designs that require integration, low power, and on-chip configurability.

Designed for industrial use, this device features 151 user I/Os, on-chip RAM, a compact 208-pin BFQFP package, and an extended operating temperature range, making it suitable for portable, battery-backed, and industrial applications where reliability and board-level density matter.

Key Features

  • Core and Logic — Approximately 9,216 logic elements delivering a 400,000-gate equivalent fabric for implementing custom logic and glue-logic functions.
  • Embedded Memory — 55,296 bits of on-chip RAM (approximately 0.055 Mbits) to support FIFOs, state machines, and small data buffers.
  • Rich I/O Count — 151 user I/Os to connect sensors, peripherals, and external logic with flexible banking.
  • Package and Mounting — 208-BFQFP package (supplier device package: 208-PQFP, 28×28) in a surface-mount form factor for high-density board designs.
  • Power Supply — Core supply range specified at 1.425 V to 1.575 V to match low-voltage system designs.
  • Temperature and Grade — Industrial-grade device with an operating temperature range of −40 °C to 100 °C for use in harsher environments.
  • Nonvolatile, Reprogrammable Flash — ProASIC3 family heritage: flash-based reprogrammability that retains the programmed design when powered off.
  • Environmental Compliance — RoHS-compliant construction to meet modern regulatory requirements.

Typical Applications

  • Portable and Battery-Powered Devices — Low-voltage core and nonvolatile configuration enable instant-on and power-efficient operation in compact, battery-backed systems.
  • Consumer and High-Volume Electronics — Reprogrammable flash FPGA allows design flexibility and fast time-to-market for product variants and iterative feature updates.
  • Industrial Control and Instrumentation — Industrial temperature range and robust I/O count support control logic, signal interfacing, and customization in industrial equipment.

Unique Advantages

  • Nonvolatile Configuration: Flash-based technology retains programmed logic when power is removed, reducing external configuration components.
  • High I/O Density: 151 user I/Os in a 208-pin BFQFP package provides a balance of connectivity and compact board footprint.
  • Industrial Temperature Range: −40 °C to 100 °C rating supports deployment in temperature-challenging environments.
  • Compact Surface-Mount Package: 208-PQFP (28×28) surface-mount package simplifies assembly for medium-density PCBs.
  • Proven Family Features: Leverages ProASIC3 family capabilities such as low-power operation and reprogrammability for flexible design iterations.
  • Regulatory Compliance: RoHS status is compliant to support modern manufacturing and distribution requirements.

Why Choose M1A3P400-PQG208I?

The M1A3P400-PQG208I combines a substantial logic capacity (≈400k gates, ~9,216 logic elements) with a high I/O count and nonvolatile flash configuration to deliver a compact, reprogrammable solution for space- and power-conscious designs. Its industrial temperature rating and surface-mount 208-BFQFP package make it well suited for products that require rugged operation and reliable board-level integration.

As a member of the ProASIC3 family from Microchip Technology, this device provides designers a balance of integration, low-power operation, and reprogrammability—helping reduce BOM complexity and enabling firmware-style updates to hardware logic without changing physical components.

Request a quote or submit a procurement inquiry to discuss availability, pricing, and how the M1A3P400-PQG208I can fit into your next design.

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