M1A3P400-PQG208I
| Part Description |
ProASIC3 Field Programmable Gate Array (FPGA) IC 151 55296 208-BFQFP |
|---|---|
| Quantity | 413 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 14 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 151 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 9216 | Number of Logic Elements/Cells | 9216 | ||
| Number of Gates | 400000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 55296 |
Overview of M1A3P400-PQG208I – ProASIC3 FPGA, 151 I/Os, 208-BFQFP
The M1A3P400-PQG208I is a ProASIC3 family Field Programmable Gate Array (FPGA) IC from Microchip Technology. It delivers a reprogrammable, nonvolatile FPGA fabric with 400,000 system gates and approximately 9,216 logic elements, targeted at designs that require integration, low power, and on-chip configurability.
Designed for industrial use, this device features 151 user I/Os, on-chip RAM, a compact 208-pin BFQFP package, and an extended operating temperature range, making it suitable for portable, battery-backed, and industrial applications where reliability and board-level density matter.
Key Features
- Core and Logic — Approximately 9,216 logic elements delivering a 400,000-gate equivalent fabric for implementing custom logic and glue-logic functions.
- Embedded Memory — 55,296 bits of on-chip RAM (approximately 0.055 Mbits) to support FIFOs, state machines, and small data buffers.
- Rich I/O Count — 151 user I/Os to connect sensors, peripherals, and external logic with flexible banking.
- Package and Mounting — 208-BFQFP package (supplier device package: 208-PQFP, 28×28) in a surface-mount form factor for high-density board designs.
- Power Supply — Core supply range specified at 1.425 V to 1.575 V to match low-voltage system designs.
- Temperature and Grade — Industrial-grade device with an operating temperature range of −40 °C to 100 °C for use in harsher environments.
- Nonvolatile, Reprogrammable Flash — ProASIC3 family heritage: flash-based reprogrammability that retains the programmed design when powered off.
- Environmental Compliance — RoHS-compliant construction to meet modern regulatory requirements.
Typical Applications
- Portable and Battery-Powered Devices — Low-voltage core and nonvolatile configuration enable instant-on and power-efficient operation in compact, battery-backed systems.
- Consumer and High-Volume Electronics — Reprogrammable flash FPGA allows design flexibility and fast time-to-market for product variants and iterative feature updates.
- Industrial Control and Instrumentation — Industrial temperature range and robust I/O count support control logic, signal interfacing, and customization in industrial equipment.
Unique Advantages
- Nonvolatile Configuration: Flash-based technology retains programmed logic when power is removed, reducing external configuration components.
- High I/O Density: 151 user I/Os in a 208-pin BFQFP package provides a balance of connectivity and compact board footprint.
- Industrial Temperature Range: −40 °C to 100 °C rating supports deployment in temperature-challenging environments.
- Compact Surface-Mount Package: 208-PQFP (28×28) surface-mount package simplifies assembly for medium-density PCBs.
- Proven Family Features: Leverages ProASIC3 family capabilities such as low-power operation and reprogrammability for flexible design iterations.
- Regulatory Compliance: RoHS status is compliant to support modern manufacturing and distribution requirements.
Why Choose M1A3P400-PQG208I?
The M1A3P400-PQG208I combines a substantial logic capacity (≈400k gates, ~9,216 logic elements) with a high I/O count and nonvolatile flash configuration to deliver a compact, reprogrammable solution for space- and power-conscious designs. Its industrial temperature rating and surface-mount 208-BFQFP package make it well suited for products that require rugged operation and reliable board-level integration.
As a member of the ProASIC3 family from Microchip Technology, this device provides designers a balance of integration, low-power operation, and reprogrammability—helping reduce BOM complexity and enabling firmware-style updates to hardware logic without changing physical components.
Request a quote or submit a procurement inquiry to discuss availability, pricing, and how the M1A3P400-PQG208I can fit into your next design.

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