M1A3P600-1FG256
| Part Description |
ProASIC3 Field Programmable Gate Array (FPGA) IC 177 110592 256-LBGA |
|---|---|
| Quantity | 220 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 177 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 13824 | Number of Logic Elements/Cells | 13824 | ||
| Number of Gates | 600000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 110592 |
Overview of M1A3P600-1FG256 – ProASIC3 Field Programmable Gate Array (FPGA) IC 177 110592 256-LBGA
The M1A3P600-1FG256 is a flash-based ProASIC3 FPGA from Microchip Technology designed for commercial embedded applications requiring reprogrammable nonvolatile logic. It integrates 600,000 system gates and 13,824 logic elements with on-chip user memory and advanced clocking resources to support high-density, instant-on designs.
With 177 user I/Os, a 256-LBGA package, and a core supply range centered around 1.5 V, this device targets mixed-voltage interfacing, secure in-system programming, and compact surface-mount implementations in commercial electronics.
Key Features
- Capacity and Logic: 13,824 logic elements (VersaTiles) and approximately 600,000 system gates provide substantial combinational and sequential resources for mid-density designs.
- Embedded Memory: 110,592 bits of on-chip RAM (≈108 kbits) for embedded data storage, FIFOs, and buffers with true dual-port RAM configurations available in the family.
- I/O and Interface Flexibility: 177 user I/Os supporting mixed-voltage operation and high-speed signaling options as provided in the ProASIC3 family.
- Nonvolatile Flash and On-Chip ROM: Reprogrammable flash architecture with 1 kbit of on-chip FlashROM for configuration storage and instant-on behavior.
- Security and In-System Programming: Supports AES-based secure ISP mechanisms and FlashLock® protection as described for the ProASIC3 family, enabling encrypted JTAG programming and content protection.
- Clocking and PLLs: Integrated clock conditioning circuitry with six CCC blocks and PLL capability for flexible clock generation and conditioning up to family performance limits.
- Performance: Family-level system performance up to 350 MHz, suitable for demanding control and data-path functions.
- Power and Supply: Core voltage supply range 1.425 V to 1.575 V (supports 1.5 V system operation) for low-power core operation.
- Package and Mounting: 256-LBGA package (supplier package: 256-FPBGA, 17×17) with surface-mount mounting for compact board designs.
- Commercial Grade and Environmental: Rated for 0 °C to 85 °C operating temperature and RoHS compliant for commercial applications.
Typical Applications
- Commercial Embedded Systems: Implement control logic, protocol translation, and custom interfaces where reprogrammable, nonvolatile logic is required.
- Communications and Networking: Use on-board I/O and embedded RAM for packet buffering, signal conditioning, and mixed-voltage interface bridging.
- Secure In-System Updates: Leverage AES-based ISP and FlashLock features for secure field upgrades and IP protection in customer devices.
- Prototype and ASIC Replacement: Deploy as a single-chip, instant-on solution for proof-of-concept or low- to mid-volume ASIC replacement with reprogrammability.
Unique Advantages
- Reprogrammable Nonvolatile Logic: Flash-based configuration retains designs without external configuration memory and enables instant-on startup.
- On-Chip Memory and Resources: Integrated RAM and 13,824 logic elements reduce external component count and simplify board-level design.
- Secure Field Programming: AES-based ISP via JTAG and FlashLock® support secure firmware delivery and intellectual property protection.
- Flexible Clocking: Six CCC blocks with PLLs provide extensive clock-conditioning options for synchronized, high-performance systems.
- Compact Surface-Mount Packaging: 256-LBGA (256-FPBGA, 17×17) offers a space-efficient footprint for compact commercial products.
- Commercial Temperature and RoHS Compliance: Designed for 0 °C to 85 °C operation and RoHS-compliant manufacturing for mainstream electronics production.
Why Choose M1A3P600-1FG256?
The M1A3P600-1FG256 combines mid-density logic capacity with integrated nonvolatile flash and embedded memory, delivering a compact, reprogrammable solution for commercial embedded designs. Its mix of high-speed family-level capabilities, secure in-system programming, and flexible I/O makes it a practical choice for product designers who need instant-on behavior and on-board configurability without adding external configuration devices.
This device is well suited to teams optimizing board space, reducing BOM complexity, and requiring reliable reprogrammability and content protection. Backed by the ProASIC3 family feature set, it offers clear scalability for similar designs within the same device family.
Request a quote or submit a sales inquiry to learn about availability, pricing, and lead times for the M1A3P600-1FG256. Our team can provide the technical and purchasing information needed to move your design forward.

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