M1A3P600-1FG484I
| Part Description |
ProASIC3 Field Programmable Gate Array (FPGA) IC 235 110592 484-BGA |
|---|---|
| Quantity | 197 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | Tray | Number of I/O | 235 | Voltage | 1.425 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | N/A | REACH Compliance | N/A | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | 13824 | Number of Logic Elements/Cells | 13824 | ||
| Number of Gates | 600000 | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 108000 |
Overview of M1A3P600-1FG484I – ProASIC3 Field Programmable Gate Array (FPGA) IC, 235 I/Os, 13,824 Logic Elements, 484-FPBGA
The M1A3P600-1FG484I is a ProASIC3-series flash FPGA from Microchip Technology designed for secure, reprogrammable logic integration. It combines 600,000 system gates with 13,824 logic elements and up to 235 user I/Os in a 484-FPBGA (23×23) surface-mount package.
Targeted at industrial applications, this device provides nonvolatile flash-based configuration, on-chip memory, and integrated clocking/security features to support compact, secure, and deterministic embedded designs operating from –40 °C to 100 °C.
Key Features
- Core Logic 600,000 system gates and 13,824 logic elements for medium-density FPGA implementations.
- Embedded Memory Approximately 0.108 Mbits (108,000 bits) of on-chip RAM; on-chip 1 kbit FlashROM for nonvolatile storage and configuration.
- I/O Capacity 235 user I/Os to support diverse interface requirements and parallel connectivity.
- Package & Mounting 484-FPBGA (23×23) supplier device package, surface-mount mounting, packaged in tray for PCB assembly.
- Voltage & Power Core/standby operation specified at 1.425 V.
- Temperature Range Industrial operating range from –40 °C to 100 °C for deployments in demanding environments.
- Security and In-System Programming Family-level support for in-system programming and on-chip AES-based ISP (as described in the ProASIC3E datasheet) to secure configuration updates via JTAG.
- Clocking and Timing Family-level clock conditioning resources including integrated PLLs and CCC blocks for flexible clock management and high-performance routing (refer to datasheet for details).
Typical Applications
- Industrial Control — Implement motor control, sequencing, and deterministic I/O aggregation using the device’s logic density, plentiful I/Os, and industrial temperature rating.
- Embedded Systems — Use as a compact, reprogrammable logic platform with on-chip nonvolatile FlashROM for instant-on behavior and secure configuration storage.
- Communications and Interface Bridging — Leverage the high I/O count and flexible I/O standards (as supported by the ProASIC3 family) to support protocol conversion and multi-channel I/O subsystems.
Unique Advantages
- Nonvolatile Flash Configuration: Retains programmed design when powered off and enables instant-on system behavior.
- Integrated Security and ISP: On-chip AES-based in-system programming capability (family feature) reduces the need for external secure programming hardware.
- Balanced Integration: Combines 600k gates, substantial embedded RAM, and 235 I/Os in a single 484-FPBGA package to lower BOM and PCB area compared with multi-chip solutions.
- Industrial Temperature Rating: Rated for –40 °C to 100 °C operation, enabling deployment in a wide range of industrial environments.
- Deterministic Clocking: Family clock conditioning circuitry and integrated PLLs provide flexible clock management for high-performance designs.
Why Choose M1A3P600-1FG484I?
The M1A3P600-1FG484I positions itself as a secure, mid-density ProASIC3 FPGA option for designs that require nonvolatile configuration, a substantial I/O complement, and industrial temperature capability. Its combination of 600k system gates, 13,824 logic elements, approximately 0.108 Mbits of embedded RAM, and on-chip FlashROM supports compact, reprogrammable solutions without external configuration memory.
This device is well suited to engineering teams building industrial embedded systems, communications interfaces, and control applications that benefit from instant-on behavior, integrated security for configuration, and a 484-FPBGA form factor for space-constrained PCBs.
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