M1A3P600-1FG484
| Part Description |
ProASIC3 Field Programmable Gate Array (FPGA) IC 235 110592 484-BGA |
|---|---|
| Quantity | 915 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 235 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 13824 | Number of Logic Elements/Cells | 13824 | ||
| Number of Gates | 600000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 110592 |
Overview of M1A3P600-1FG484 – ProASIC3 Field Programmable Gate Array (FPGA) IC 235 I/Os, 110592 bits, 484‑BGA
The M1A3P600-1FG484 is a ProASIC3 Field Programmable Gate Array (FPGA) IC from Microchip Technology. It delivers a balanced mix of logic capacity, on-chip memory, and a high I/O count in a compact 484‑BGA package for commercial-temperature embedded designs.
With 13,824 logic elements, approximately 0.11 Mbits of embedded memory and 235 user I/Os, the device is suited to applications that require mid-range programmable logic integration while maintaining surface-mount, RoHS‑compliant packaging.
Key Features
- Core Logic 13,824 logic elements (logic element cells) providing a total equivalent of 600,000 gates for implementing custom digital functions and state machines.
- On‑Chip Memory Total on-chip RAM of 110,592 bits (approximately 0.11 Mbits) for small to moderate embedded memory needs such as buffering and FIFO implementations.
- I/O Resources 235 available I/Os to support multiple interfaces, external peripherals, and board-level signal routing requirements.
- Power Specified core supply range of 1.425 V to 1.575 V to match defined system power rails.
- Package & Mounting 484‑BGA (supplier device package: 484‑FPBGA, 23 × 23) in a surface‑mount form factor for dense PCB designs.
- Temperature & Grade Commercial operating temperature range of 0°C to 85°C and commercial grade designation for standard embedded applications.
- Compliance RoHS‑compliant construction to meet common environmental and manufacturing requirements.
Typical Applications
- Interface Bridging Use the 235 I/Os and abundant logic elements to combine or translate multiple peripheral interfaces on a single device.
- Glue Logic and Control Consolidate discrete glue logic and custom control functions into programmable logic leveraging the device’s 13,824 logic elements.
- Prototyping and Evaluation Implement prototype digital functions and proof‑of‑concept designs that require reprogrammable logic and embedded RAM.
- Embedded Sequencing and State Machines Deploy the device’s logic resources and on‑chip RAM for deterministic control, sequencing, and finite state machine implementations.
Unique Advantages
- Significant Logic Capacity: 13,824 logic elements and 600,000 equivalent gates enable integration of sizable custom logic without immediate escalation to larger devices.
- High I/O Count: 235 user I/Os provide flexibility for multi‑bus, multi‑peripheral, and complex board interconnect topologies.
- Compact BGA Packaging: 484‑BGA (23 × 23) offers a dense, surface‑mount solution that minimizes PCB footprint while supporting many I/Os.
- Defined Power Envelope: A specified core supply window (1.425 V–1.575 V) simplifies power-supply selection and system design integration.
- RoHS Compliance: RoHS‑compliant construction supports modern manufacturing and environmental requirements.
Why Choose M1A3P600-1FG484?
The M1A3P600-1FG484 positions itself as a practical choice for designers who need a mid-range FPGA with substantial logic resources, a notable I/O complement, and on‑chip memory in a compact BGA package. Its combination of 13,824 logic elements, approximately 0.11 Mbits of RAM and 235 I/Os makes it suitable for consolidating logic, implementing control systems, and bridging interfaces in commercial-temperature applications.
Backed by Microchip Technology’s ProASIC3 naming, the device provides a clear specification set—power range, package, temperature rating and RoHS compliance—so engineering and procurement teams can evaluate system fit and long‑term sourcing with confidence.
Request a quote or submit an inquiry to obtain pricing, availability and lead‑time information for the M1A3P600-1FG484.

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