M1A3P600-1FG484

IC FPGA 235 I/O 484FBGA
Part Description

ProASIC3 Field Programmable Gate Array (FPGA) IC 235 110592 484-BGA

Quantity 915 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BGANumber of I/O235Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs13824Number of Logic Elements/Cells13824
Number of Gates600000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits110592

Overview of M1A3P600-1FG484 – ProASIC3 Field Programmable Gate Array (FPGA) IC 235 I/Os, 110592 bits, 484‑BGA

The M1A3P600-1FG484 is a ProASIC3 Field Programmable Gate Array (FPGA) IC from Microchip Technology. It delivers a balanced mix of logic capacity, on-chip memory, and a high I/O count in a compact 484‑BGA package for commercial-temperature embedded designs.

With 13,824 logic elements, approximately 0.11 Mbits of embedded memory and 235 user I/Os, the device is suited to applications that require mid-range programmable logic integration while maintaining surface-mount, RoHS‑compliant packaging.

Key Features

  • Core Logic  13,824 logic elements (logic element cells) providing a total equivalent of 600,000 gates for implementing custom digital functions and state machines.
  • On‑Chip Memory  Total on-chip RAM of 110,592 bits (approximately 0.11 Mbits) for small to moderate embedded memory needs such as buffering and FIFO implementations.
  • I/O Resources  235 available I/Os to support multiple interfaces, external peripherals, and board-level signal routing requirements.
  • Power  Specified core supply range of 1.425 V to 1.575 V to match defined system power rails.
  • Package & Mounting  484‑BGA (supplier device package: 484‑FPBGA, 23 × 23) in a surface‑mount form factor for dense PCB designs.
  • Temperature & Grade  Commercial operating temperature range of 0°C to 85°C and commercial grade designation for standard embedded applications.
  • Compliance  RoHS‑compliant construction to meet common environmental and manufacturing requirements.

Typical Applications

  • Interface Bridging  Use the 235 I/Os and abundant logic elements to combine or translate multiple peripheral interfaces on a single device.
  • Glue Logic and Control  Consolidate discrete glue logic and custom control functions into programmable logic leveraging the device’s 13,824 logic elements.
  • Prototyping and Evaluation  Implement prototype digital functions and proof‑of‑concept designs that require reprogrammable logic and embedded RAM.
  • Embedded Sequencing and State Machines  Deploy the device’s logic resources and on‑chip RAM for deterministic control, sequencing, and finite state machine implementations.

Unique Advantages

  • Significant Logic Capacity:  13,824 logic elements and 600,000 equivalent gates enable integration of sizable custom logic without immediate escalation to larger devices.
  • High I/O Count:  235 user I/Os provide flexibility for multi‑bus, multi‑peripheral, and complex board interconnect topologies.
  • Compact BGA Packaging:  484‑BGA (23 × 23) offers a dense, surface‑mount solution that minimizes PCB footprint while supporting many I/Os.
  • Defined Power Envelope:  A specified core supply window (1.425 V–1.575 V) simplifies power-supply selection and system design integration.
  • RoHS Compliance:  RoHS‑compliant construction supports modern manufacturing and environmental requirements.

Why Choose M1A3P600-1FG484?

The M1A3P600-1FG484 positions itself as a practical choice for designers who need a mid-range FPGA with substantial logic resources, a notable I/O complement, and on‑chip memory in a compact BGA package. Its combination of 13,824 logic elements, approximately 0.11 Mbits of RAM and 235 I/Os makes it suitable for consolidating logic, implementing control systems, and bridging interfaces in commercial-temperature applications.

Backed by Microchip Technology’s ProASIC3 naming, the device provides a clear specification set—power range, package, temperature rating and RoHS compliance—so engineering and procurement teams can evaluate system fit and long‑term sourcing with confidence.

Request a quote or submit an inquiry to obtain pricing, availability and lead‑time information for the M1A3P600-1FG484.

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