M1A3P600-1FGG256

The M1A3P600-1FGG256 is a ProASIC3 family FPGA offering programmable digital logic with 600,000 gates, 13,824 logic elements, and 110,592 bits of embedded RAM. Packaged in a compact 256-LBGA (supplier package 256-FPBGA 17×17) and designed for surface-mount assembly, it provides a combination of logic density and I/O capacity for commercial electronic designs.

With 177 user I/O pins and a core supply range of 1.425 V to 1.575 V, this device is suited to applications that require substantial on-chip logic and memory while maintaining a small PCB footprint and standard commercial temperature operation (0 °C to 85 °C).

Key Features

• Core Logic 600,000 gates and 13,824 logic elements (cells) to implement custom digital functions and moderate-complexity designs.
• Embedded Memory 110,592 bits of on-chip RAM (approximately 0.11 Mbits) for local buffering, FIFOs, and state storage.
• I/O Density 177 user I/O pins to support multiple external peripherals and interfaces without extensive external logic.
• Power Supply Operates from a core voltage range of 1.425 V to 1.575 V for compatibility with targeted system power rails.
• Package & Mounting 256-LBGA (supplier 256-FPBGA, 17×17) in a surface-mount form factor for space-constrained board designs.
• Operating Range & Grade Commercial-grade device with specified operating temperature from 0 °C to 85 °C.
• Environmental Compliance RoHS compliant to support lead-free manufacturing processes.

Typical Applications

• Embedded Control Implement custom control logic, state machines, and peripheral handling using the device's logic elements and on-chip RAM.
• Sensor and I/O Aggregation Aggregate and buffer signals from multiple sensors or front-end circuits using the extensive 177 I/O pins and embedded memory.
• Prototyping and Development Rapidly prototype digital functions and proof-of-concept systems that require reconfigurable logic and moderate memory resources.
• Interface Bridging Consolidate multiple interface signals and protocol handling within a single FPGA to reduce external component count.

Unique Advantages

• High logic capacity: 600,000 gates and 13,824 logic elements enable implementation of moderately complex digital designs without external processors.
• Extensive I/O: 177 user I/O pins minimize the need for external I/O expansion, simplifying PCB routing and BOM.
• On-chip memory: 110,592 bits of RAM provide local storage for buffering and state retention, reducing dependence on external memory.
• Compact, manufacturable package: 256-LBGA (17×17 FPBGA) and surface-mount mounting support high-density board layouts for commercial products.
• Commercial temperature rating: Specified 0 °C to 85 °C operation aligns with standard commercial product deployments.

Why Choose M1A3P600-1FGG256?

The M1A3P600-1FGG256 delivers a balance of logic density, on-chip RAM, and high I/O count in a compact 256-LBGA package, making it suitable for commercial embedded designs that require reconfigurable digital logic and signal aggregation. Its defined voltage range and operating temperature make it straightforward to integrate into standard commercial systems.

This part is a practical choice for engineers seeking a single-device solution to implement custom logic, consolidate interfaces, and reduce external component count while maintaining manufacturability and RoHS compliance. Refer to the manufacturer's datasheet for full electrical and functional details.

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