M1A3P600-1FGG144

The M1A3P600-1FGG144 is a ProASIC3 Field Programmable Gate Array (FPGA) IC designed for applications that require user-configurable logic and a compact BGA footprint. It provides 13,824 logic elements and 600,000 gates together with a moderate amount of embedded RAM, packaged in a 144‑pin BGA suitable for surface-mount assembly.

With a specified supply range of 1.425 V to 1.575 V and a commercial operating temperature range of 0 °C to 85 °C, this device targets designs that need deterministic on-board logic, a mid-level gate count, and standard commercial-grade environmental performance.

Key Features

• Logic Capacity — 13,824 logic elements providing a total of 600,000 gates for implementing combinational and sequential logic functions.
• Embedded Memory — Approximately 0.11 Mbits of on-chip RAM (110,592 bits) to support data buffering, small FIFOs, and state storage.
• I/O Count — 97 user I/O pins for interfacing to peripherals, sensors, and external logic devices.
• Power Supply — Operates from a core voltage range of 1.425 V to 1.575 V to match system power rails and enable predictable power budgeting.
• Package and Mounting — 144‑LBGA / 144‑FPBGA (13×13) package in a surface-mount format for compact board layouts and reliable solder attachment.
• Operating Grade — Commercial grade device rated for 0 °C to 85 °C ambient operation.
• Regulatory Compliance — RoHS compliant for environmental and materials conformity.

Typical Applications

• Embedded Control — Implement custom control logic, state machines, and interface aggregation for embedded systems using the device’s logic elements and I/O resources.
• Communications Interfaces — Build protocol bridges, serializers/deserializers, or custom I/O converters that leverage the 97 I/O pins and on-chip resources.
• Consumer and Industrial Electronics — Integrate device control, signal processing front-ends, or glue logic in commercial-grade electronics where the 0 °C to 85 °C rating is appropriate.

Unique Advantages

• Balanced Logic Density: 13,824 logic elements and 600,000 gates provide a mid-range capacity suitable for moderate-complexity designs without excessive board-level integration.
• Embedded Memory for Local Storage: Approximately 0.11 Mbits of on-chip RAM enables compact implementations of buffering and small data structures without external memory.
• Generous I/O Count: Ninety-seven I/O pins allow direct interfacing to multiple peripherals and devices, reducing the need for external multiplexing components.
• Compact BGA Package: 144‑pin LBGA / FPBGA (13×13) helps conserve PCB real estate while supporting reliable surface-mount assembly.
• Commercial Temperature Suitability: Rated for 0 °C to 85 °C operation to match a wide range of commercial electronics applications.
• RoHS Compliant: Conforms to RoHS requirements for materials compliance in modern electronic designs.

Why Choose M1A3P600-1FGG144?

The M1A3P600-1FGG144 offers a practical combination of logic capacity, I/O flexibility, and compact packaging for designers needing configurable logic in commercial-grade products. Its 13,824 logic elements, 600,000 gates, and on-chip RAM provide the resources required for custom control, interfacing, and mid-level signal processing tasks while maintaining a small PCB footprint.

This device is well-suited to engineering teams developing embedded systems, communications interfaces, or consumer and industrial electronics that require reliable, programmable logic with standard commercial environmental ratings and RoHS compliance.

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