M1A3P600-1FGG484

The M1A3P600-1FGG484 is a ProASIC3 Field Programmable Gate Array (FPGA) IC from Microchip Technology. It provides a programmable logic platform with 600,000 gates and 13,824 logic elements for implementing custom digital logic and system glue.

With 235 available I/O, approximately 110,592 bits of embedded memory, a 484-ball BGA package (484-FPBGA, 23×23), and a core voltage supply range of 1.425 V to 1.575 V, this device targets commercial designs that require substantial logic capacity in a compact surface-mount package.

Key Features

• Core Logic  Provides 600,000 gates and 13,824 logic elements to support complex combinational and sequential designs.
• Embedded Memory  Includes 110,592 bits of on-chip RAM (approximately 0.11 Mbit) for local data storage and state machines.
• I/O Capacity  235 total I/O pins enable extensive board-level interfacing and connectivity options for external peripherals and interfaces.
• Package  484-ball fine-pitch BGA (484-FPBGA, 23×23) in a surface-mount form factor for compact PCB integration.
• Power  Core voltage supply specified from 1.425 V to 1.575 V to match required FPGA operating ranges.
• Operating Range  Commercial temperature grade with operating range from 0 °C to 85 °C.
• Compliance  RoHS compliant for environmental conformity in commercial electronic products.

Typical Applications

• Custom Logic Integration  Implement complex glue logic, protocol translation, and finite-state machines using the available 600,000 gates and 13,824 logic elements.
• Interface and I/O Expansion  Leverage 235 I/O pins to add or bridge multiple peripheral interfaces on compact PCBs.
• Embedded Memory-dependent Functions  Use the on-chip 110,592 bits of RAM for small buffers, lookup tables, and local data storage in embedded systems.

Unique Advantages

• High logic capacity: 600,000 gates and 13,824 logic elements provide the headroom needed for complex digital designs without immediately moving to larger devices.
• Substantial I/O count: 235 I/O pins enable flexible interfacing to multiple external components and buses, reducing the need for external I/O expanders.
• Compact BGA footprint: 484-ball FPBGA (23×23) offers a high pin-count solution in a space-efficient surface-mount package suitable for dense PCB layouts.
• Defined power envelope: Core supply range of 1.425 V to 1.575 V provides clear supply requirements for power-supply design and system integration.
• Commercial temperature rating: Rated for 0 °C to 85 °C operation to match mainstream electronic product environments.
• RoHS compliant: Conforms to RoHS requirements for environmental compliance in commercial products.

Why Choose M1A3P600-1FGG484?

The M1A3P600-1FGG484 delivers a balance of logic density, I/O capacity, and embedded memory in a compact 484-BGA surface-mount package, making it a suitable choice for commercial designs that require significant programmable logic in a limited board area. Its defined voltage supply range and commercial temperature rating simplify integration into established power and thermal budgets.

Designed and supplied by Microchip Technology, this ProASIC3 device is appropriate for engineering teams seeking a field-programmable solution with clear specifications for gates, logic elements, I/O, and on-chip RAM—supporting scalable implementation and reliable system integration.

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