M1A3P600-1PQG208
| Part Description |
ProASIC3 Field Programmable Gate Array (FPGA) IC 154 110592 208-BFQFP |
|---|---|
| Quantity | 993 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 14 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 154 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 13824 | Number of Logic Elements/Cells | 13824 | ||
| Number of Gates | 600000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 110592 |
Overview of M1A3P600-1PQG208 – ProASIC3 Field Programmable Gate Array (FPGA) IC 154 110592 208-BFQFP
The M1A3P600-1PQG208 is a ProASIC3 series flash-based FPGA in a 208-pin PQFP package intended for commercial applications. It provides a reprogrammable, nonvolatile architecture with on-chip FlashROM and a balance of logic capacity, embedded memory, and I/O for high-density system designs. Typical use cases include designs that require instant-on nonvolatile configuration, mixed-voltage I/O interfacing, and compact surface-mount packaging.
Key Features
- Logic Capacity — 13,824 logic element cells delivering approximately 600,000 system gates for complex logic integration.
- Embedded Memory — Total on-chip RAM of 110,592 bits (approximately 0.11 Mbits) plus 1 kbit of on-chip FlashROM for nonvolatile storage and configuration.
- I/O and Package — 154 user I/Os in a 208-BFQFP (208-PQFP, 28 × 28) surface-mount package for compact board-level integration and flexible I/O allocation.
- Power — Core supply voltage range of 1.425 V to 1.575 V to support low-power core operation.
- Operating Range — Commercial grade operation from 0 °C to 85 °C suitable for standard ambient environments.
- Reprogrammable Flash Technology — Nonvolatile flash-based FPGA architecture that retains programmed design when powered off and supports in-system reprogramming and security features described by the family datasheet.
- Mounting — Surface-mount device for modern PCB assembly and automated manufacturing processes.
- Compliance — RoHS-compliant construction for regulatory and environmental conformance.
Typical Applications
- Communications and Networking — Implement protocol bridging, packet handling logic, or custom interface controllers using the device’s logic capacity and flexible I/O.
- Embedded Control and Automation — Use as a control plane or custom processing block where nonvolatile instant-on behavior and compact packaging are required.
- Prototyping and ASIC Replacement — Deploy as a reprogrammable alternative to ASICs for early production runs or iterative hardware development.
- Mixed-Voltage System Interfaces — Integrate diverse I/O voltage domains and signaling standards within a single device footprint for board-level consolidation.
Unique Advantages
- Nonvolatile, Instant-On Configuration: Flash-based architecture preserves the programmed design without external configuration memory, simplifying power-up behavior and system boot.
- Balanced Logic and Memory: 13,824 logic elements paired with approximately 0.11 Mbits of embedded RAM supports medium-complexity designs without external SRAM.
- Compact, Surface-Mount PQFP Package: 208-pin PQFP (28 × 28) enables high pin count in a package suited for automated assembly and space-constrained boards.
- Commercial Temperature and Low-Voltage Core: Designed for 0 °C to 85 °C operation with a low-voltage core supply range, helping reduce system power consumption.
- RoHS-Compliant: Environmentally compliant materials and processes align with common regulatory requirements.
Why Choose M1A3P600-1PQG208?
The M1A3P600-1PQG208 delivers a pragmatic combination of logic density, embedded RAM, and nonvolatile flash configuration in a 208-pin surface-mount package. It is well suited for designers who need a reprogrammable FPGA with instant-on behavior, a moderate number of I/Os, and a compact form factor for commercial applications.
With verified package options and RoHS compliance, this device is a solid choice for mid-density FPGA implementations where on-chip nonvolatile storage and reliable commercial-grade operation are required.
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