M1A3P600-2FG144

The M1A3P600-2FG144 is a ProASIC3 field programmable gate array (FPGA) IC from Microchip Technology, supplied in a 144-LBGA package. It provides a balance of programmable logic, on-chip memory and I/O for commercial-grade embedded designs.

With 13,824 logic elements, approximately 0.11 Mbits of embedded memory and 97 user I/O pins, this device is targeted at applications that require moderate logic density and flexible interfacing in a compact surface-mount package.

Key Features

• Core Logic  13,824 logic elements (equivalent) delivering up to 600,000 gates of programmable logic capacity for implementing custom digital functions.
• Embedded Memory  Approximately 0.11 Mbits (110,592 bits) of on-chip RAM to support buffering, state storage and small data tables without external memory.
• I/O  97 user I/O pins for flexible interfacing to peripherals, sensors and other digital subsystems.
• Power  Operates from a defined core supply range of 1.425 V to 1.575 V to match system power rails and design requirements.
• Package and Mounting  Available in a compact 144-LBGA package (supplier device package: 144-FPBGA, 13×13) and designed for surface-mount assembly.
• Operating Conditions  Commercial temperature grade with an operating range of 0 °C to 85 °C suitable for general-purpose commercial applications.
• Compliance  RoHS compliant for regulatory and environmental requirements.

Typical Applications

• Commercial Embedded Systems  Implement custom control logic and peripheral interfacing where moderate logic capacity and on-chip memory are required.
• Prototyping and Evaluation  Evaluate programmable logic implementations with a compact BGA footprint and a clear mapping of logic elements and I/O.
• Glue Logic and I/O Aggregation  Consolidate multiple discrete functions and interface signals into a single programmable device to simplify board design.

Unique Advantages

• Measured Logic Capacity:  13,824 logic elements and 600,000 gates provide a defined resource level for predictable implementation planning.
• On-Chip Memory:  110,592 bits of embedded RAM reduce the need for external memory for small buffering and state storage.
• Versatile I/O Count:  97 I/O pins enable support for multiple interfaces and peripherals without immediate reliance on external expanders.
• Compact, Surface-Mount Package:  144-LBGA (144-FPBGA, 13×13) helps save PCB area while supporting automated assembly processes.
• Commercial Temperature Rating:  Specified 0 °C to 85 °C operation for use in standard commercial environments.
• Regulatory Compliance:  RoHS compliant to meet common environmental and supply-chain requirements.

Why Choose M1A3P600-2FG144?

The M1A3P600-2FG144 positions itself as a practical, commercial-grade FPGA option where a known set of programmable resources and I/O are needed in a compact BGA package. Its combination of 13,824 logic elements, approximately 0.11 Mbits of on-chip RAM and 97 I/O pins makes it suitable for system designers balancing logic density, on-chip memory and board space.

Backed by Microchip Technology and offered in a RoHS-compliant surface-mount package, this device is appropriate for commercial embedded projects that demand predictable resource availability and standardized operating conditions.

Request a quote or submit a pricing inquiry to obtain availability and lead-time information for the M1A3P600-2FG144.