M1A3P600-2FG256I

The M1A3P600-2FG256I is a ProASIC3 flash-based Field Programmable Gate Array (FPGA) IC from Microchip Technology. It provides mid-range logic density and on-chip memory in a compact 256-LBGA package designed for surface-mount assembly.

With 13,824 logic elements, approximately 0.11 Mbits of embedded memory, 177 I/O and an industrial-grade operating range, this device targets embedded and industrial applications that require reconfigurable logic, significant I/O count and extended temperature operation.

Key Features

• Core Logic  13,824 logic elements (equivalent to 13,824 CLBs) offering programmable resources for custom digital logic and system integration.
• Gate Density  Approximately 600,000 gates to support complex logic implementations within a single FPGA device.
• Embedded Memory  Total on-chip RAM of 110,592 bits (approximately 0.11 Mbits) for data buffering, state machines and small on-chip storage needs.
• I/O Capacity  177 general-purpose I/O pins to support a wide range of peripherals, buses and interface signals.
• Power Supply  Specified supply voltage range of 1.425 V to 1.575 V for the core supply.
• Package & Mounting  256-LBGA package (256-FPBGA, 17×17) optimized for surface-mount assembly in compact system designs.
• Temperature & Grade  Industrial-grade device rated for operation from −40°C to 100°C for deployment in temperature-challenging environments.
• Environmental Compliance  RoHS compliant to support regulatory and manufacturing requirements.

Typical Applications

• Industrial Automation  Use as custom control logic, signal conditioning and interface bridging where industrial temperature range and reliability are required.
• Embedded Systems  Implement glue logic, protocol adaptation and hardware acceleration within compact, surface-mount embedded products.
• I/O-Intensive Designs  Leverage 177 I/O pins for multi-channel sensor arrays, peripheral expansion and complex interfacing tasks.

Unique Advantages

• Balanced Logic Density:  13,824 logic elements and 600,000 gates provide substantial programmable resources without requiring larger, more expensive devices.
• On-Chip RAM for Local Storage:  Approximately 0.11 Mbits of embedded memory supports buffering and control-state storage directly on the FPGA fabric.
• High I/O Count:  177 I/O pins enable integration of many external signals and peripherals, reducing the need for additional I/O expanders.
• Industrial Temperature Rating:  Rated from −40°C to 100°C to meet the demands of harsher operational environments.
• Compact Surface-Mount Package:  256-LBGA (17×17) package allows high-density board layouts while supporting automated assembly.
• Regulatory Compliance:  RoHS compliance supports environmentally conscious manufacturing processes.

Why Choose M1A3P600-2FG256I?

The M1A3P600-2FG256I positions itself as a versatile, industrial-grade FPGA offering a strong combination of logic resources, on-chip memory and a high I/O count in a compact 256-LBGA package. It is suitable for designers who need reconfigurable hardware capable of handling moderate to complex logic tasks while operating across an extended temperature range.

From embedded system integrators to industrial equipment manufacturers, this Microchip Technology ProASIC3 device delivers a practical balance of integration, reliability and manufacturability for mid-range programmable logic applications.

Request a quote or submit an inquiry to obtain pricing, lead times and further product details for the M1A3P600-2FG256I.