M1A3P600-2FG484
| Part Description |
ProASIC3 Field Programmable Gate Array (FPGA) IC 235 110592 484-BGA |
|---|---|
| Quantity | 874 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 235 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 13824 | Number of Logic Elements/Cells | 13824 | ||
| Number of Gates | 600000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 110592 |
Overview of M1A3P600-2FG484 – ProASIC3 Flash FPGA, 600k System Gates, 13,824 Logic Elements, 235 I/Os
The M1A3P600-2FG484 is a ProASIC3 flash-based Field Programmable Gate Array (FPGA) from Microchip Technology. It delivers a reprogrammable, nonvolatile FPGA fabric with integrated on-chip memory and clock conditioning, targeted at designers building high-density embedded systems and secure, low-power logic solutions.
With 600,000 system gates, 13,824 logic elements, and 235 user I/Os in a 484-ball FBGA package, this device is suited to applications that require compact, instant-on programmable logic with on-board SRAM and flash-based configuration storage.
Key Features
- Core Capacity — 600,000 system gates and 13,824 logic elements provide substantial logic density for mid-range FPGA designs.
- Embedded Memory — 110,592 bits of on-chip RAM (approximately 0.11 Mbits) for data buffering, FIFOs, and local storage.
- I/O Count & Package — 235 user I/Os in a 484-FPBGA (23 × 23) package, surface-mount mounting type for compact board integration.
- Nonvolatile Flash Configuration — Flash-based, reprogrammable configuration that retains the programmed design when powered off and supports instant-on operation.
- Clocking and PLLs — Family-level clock conditioning with integrated PLLs for flexible clock management and phase control.
- Security and In-System Programming — Family features include AES-based in-system programming and FlashLock-style content protection.
- Voltage and Power — Core supply specified from 1.425 V to 1.575 V to support low-power core operation.
- Commercial Temperature Grade — Rated for 0 °C to 85 °C operating temperature for commercial applications.
- RoHS Compliant — Device conforms to RoHS requirements for lead-free assembly environments.
Typical Applications
- Embedded Control — Implement control logic, state machines, and interface bridging in compact embedded systems using on-chip RAM and high I/O count.
- Communications & Connectivity — Use the device for protocol handling, data buffering, and timing-critical interfaces requiring flexible clocking.
- Secure Systems — Leverage flash-based configuration and on-chip programming security features for designs that require retained configuration and protected updates.
- Prototype & ASIC Replacement — Rapid development and reprogrammability make the part suitable for prototyping or replacing specific ASIC functions at lower unit volumes.
Unique Advantages
- Nonvolatile, Instant-On Architecture: Flash-based configuration retains design when powered off, enabling immediate startup without external configuration memory.
- Balanced Logic and Memory Capacity: 600k system gates with approximately 0.11 Mbits of embedded RAM supports a wide range of mid-density logic and buffering needs.
- High I/O Density in a Compact Package: 235 I/Os in a 484-FPBGA (23 × 23) footprint enables dense board-level integration while preserving signal connectivity.
- On-Board Security and ISP: Family-level AES in-system programming and FlashLock-style protection help safeguard device configuration and enable secure updates.
- Low-Power Core Voltage: Narrow core supply range (1.425 V to 1.575 V) supports optimized low-power operation for energy-sensitive designs.
- Commercial Temperature Rating: Specified 0 °C to 85 °C operating range aligns with typical commercial embedded product requirements.
Why Choose M1A3P600-2FG484?
The M1A3P600-2FG484 combines flash-based nonvolatile configuration, substantial mid-range logic capacity, and a high I/O count in a compact 484-BGA package—making it a practical choice for embedded system designers who need instant-on programmable logic with built-in memory and clocking resources. Its feature set is well suited to applications requiring secure in-field updates, moderate buffering, and flexible clock management.
This device is ideal for development teams seeking a reprogrammable, reliable FPGA for prototyping, interface logic, and embedded control functions where retention of configuration and compact board integration are priorities.
Request a quote or submit an inquiry for pricing and availability of the M1A3P600-2FG484 to get started with your design evaluation and procurement process.

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