M1A3P600-2FG484

IC FPGA 235 I/O 484FBGA
Part Description

ProASIC3 Field Programmable Gate Array (FPGA) IC 235 110592 484-BGA

Quantity 874 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BGANumber of I/O235Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs13824Number of Logic Elements/Cells13824
Number of Gates600000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits110592

Overview of M1A3P600-2FG484 – ProASIC3 Flash FPGA, 600k System Gates, 13,824 Logic Elements, 235 I/Os

The M1A3P600-2FG484 is a ProASIC3 flash-based Field Programmable Gate Array (FPGA) from Microchip Technology. It delivers a reprogrammable, nonvolatile FPGA fabric with integrated on-chip memory and clock conditioning, targeted at designers building high-density embedded systems and secure, low-power logic solutions.

With 600,000 system gates, 13,824 logic elements, and 235 user I/Os in a 484-ball FBGA package, this device is suited to applications that require compact, instant-on programmable logic with on-board SRAM and flash-based configuration storage.

Key Features

  • Core Capacity — 600,000 system gates and 13,824 logic elements provide substantial logic density for mid-range FPGA designs.
  • Embedded Memory — 110,592 bits of on-chip RAM (approximately 0.11 Mbits) for data buffering, FIFOs, and local storage.
  • I/O Count & Package — 235 user I/Os in a 484-FPBGA (23 × 23) package, surface-mount mounting type for compact board integration.
  • Nonvolatile Flash Configuration — Flash-based, reprogrammable configuration that retains the programmed design when powered off and supports instant-on operation.
  • Clocking and PLLs — Family-level clock conditioning with integrated PLLs for flexible clock management and phase control.
  • Security and In-System Programming — Family features include AES-based in-system programming and FlashLock-style content protection.
  • Voltage and Power — Core supply specified from 1.425 V to 1.575 V to support low-power core operation.
  • Commercial Temperature Grade — Rated for 0 °C to 85 °C operating temperature for commercial applications.
  • RoHS Compliant — Device conforms to RoHS requirements for lead-free assembly environments.

Typical Applications

  • Embedded Control — Implement control logic, state machines, and interface bridging in compact embedded systems using on-chip RAM and high I/O count.
  • Communications & Connectivity — Use the device for protocol handling, data buffering, and timing-critical interfaces requiring flexible clocking.
  • Secure Systems — Leverage flash-based configuration and on-chip programming security features for designs that require retained configuration and protected updates.
  • Prototype & ASIC Replacement — Rapid development and reprogrammability make the part suitable for prototyping or replacing specific ASIC functions at lower unit volumes.

Unique Advantages

  • Nonvolatile, Instant-On Architecture: Flash-based configuration retains design when powered off, enabling immediate startup without external configuration memory.
  • Balanced Logic and Memory Capacity: 600k system gates with approximately 0.11 Mbits of embedded RAM supports a wide range of mid-density logic and buffering needs.
  • High I/O Density in a Compact Package: 235 I/Os in a 484-FPBGA (23 × 23) footprint enables dense board-level integration while preserving signal connectivity.
  • On-Board Security and ISP: Family-level AES in-system programming and FlashLock-style protection help safeguard device configuration and enable secure updates.
  • Low-Power Core Voltage: Narrow core supply range (1.425 V to 1.575 V) supports optimized low-power operation for energy-sensitive designs.
  • Commercial Temperature Rating: Specified 0 °C to 85 °C operating range aligns with typical commercial embedded product requirements.

Why Choose M1A3P600-2FG484?

The M1A3P600-2FG484 combines flash-based nonvolatile configuration, substantial mid-range logic capacity, and a high I/O count in a compact 484-BGA package—making it a practical choice for embedded system designers who need instant-on programmable logic with built-in memory and clocking resources. Its feature set is well suited to applications requiring secure in-field updates, moderate buffering, and flexible clock management.

This device is ideal for development teams seeking a reprogrammable, reliable FPGA for prototyping, interface logic, and embedded control functions where retention of configuration and compact board integration are priorities.

Request a quote or submit an inquiry for pricing and availability of the M1A3P600-2FG484 to get started with your design evaluation and procurement process.

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