M1A3P600-2FGG256

The M1A3P600-2FGG256 is a ProASIC3 field programmable gate array (FPGA) by Microchip Technology provided in a 256-LBGA (17×17) surface-mount package. It combines a substantial logic resource set with on-chip memory and a high I/O count to support configurable digital designs at commercial-grade operating conditions.

This device is suited to designs that require up to 177 I/O pins, 13,824 logic elements (approximately 600,000 gates), and approximately 0.11 Mbits of embedded memory, while operating from a 1.425 V to 1.575 V supply and within a 0 °C to 85 °C temperature range.

Key Features

• Core Logic 13,824 logic elements providing approximately 600,000 gates for implementing custom digital functions and state machines.
• Embedded Memory Total on-chip RAM of 110,592 bits (approximately 0.11 Mbits) for buffering, FIFOs, and small data storage needs.
• I/O Capacity Up to 177 I/O pins to support extensive external interfacing and peripheral connectivity.
• Power Operates from a nominal supply range of 1.425 V to 1.575 V to match system power budgets and domain requirements.
• Package & Mounting 256-LBGA (supplier package 256-FPBGA 17×17) in a surface-mount form factor for compact board layouts.
• Temperature & Grade Commercial grade device specified for operation from 0 °C to 85 °C for standard commercial applications.
• Regulatory RoHS-compliant status for adherence to common materials restrictions.

Typical Applications

• Custom Logic and Glue Logic — Implement application-specific combinational and sequential logic using the device’s 13,824 logic elements and 600,000 gates.
• I/O-Intensive Interfaces — Use the 177 available I/Os to aggregate and route signals between multiple peripherals or subsystems.
• Embedded Data Buffering — Leverage approximately 0.11 Mbits of on-chip RAM for small FIFOs, buffering, and temporary storage in streaming or control paths.
• Compact System Integration — The 256-LBGA (17×17) package supports space-constrained PCB designs requiring a surface-mount FPGA solution.

Unique Advantages

• Balanced Logic Density: 13,824 logic elements and ~600,000 gates provide a mid-range capacity suitable for a wide variety of custom digital functions without excessive board-level complexity.
• High I/O Count: 177 I/Os enable extensive external connectivity for sensor aggregation, control signals, and peripheral interfaces.
• On-Chip Memory: Approximately 0.11 Mbits of embedded RAM reduces the need for immediate external memory for small buffering tasks, simplifying BOM and layout.
• Compact Package: 256-LBGA (17×17) surface-mount footprint supports integration into space-sensitive designs while maintaining robust connectivity.
• Commercial-Grade Operating Range: Specified 0 °C to 85 °C operation aligns with standard commercial deployments and environments.
• RoHS Compliant: Materials compliance helps meet regulatory requirements for many global product designs.

Why Choose M1A3P600-2FGG256?

The M1A3P600-2FGG256 offers a practical combination of logic resources, embedded memory, and high I/O count in a compact 256-LBGA package for commercial-grade applications. Its specified supply voltage range and operating temperature make it suitable for designers looking for a predictable, configurable logic device that integrates into standard power and thermal envelopes.

Choose this ProASIC3 FPGA when your design requires a mid-density programmable logic solution with substantial I/O capability, on-chip memory for buffering, and a compact surface-mount package that supports streamlined board layouts and reduced external component count.

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