M1A3P600-2FGG484

The M1A3P600-2FGG484 is a ProASIC3 Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for commercial embedded logic applications. It provides a balance of logic density, on-chip memory and I/O capability in a 484-ball BGA package suited for surface-mount assembly.

With 13,824 logic elements, approximately 0.11 Mbits of embedded memory and 235 user I/Os, this device targets designs that require substantial programmable logic and flexible interfacing while operating within standard commercial environmental limits.

Key Features

• Logic Density  13,824 logic elements (equivalent to 600,000 gates) for implementing medium-complexity digital functions and custom hardware acceleration.
• Embedded Memory  Approximately 0.11 Mbits of on-chip RAM (110,592 bits) to support buffering, state storage and small data structures without external memory.
• I/O Capacity  235 user I/Os giving broad connectivity options for interfaces, peripherals and board-level signals.
• Power  Operates from a core voltage supply range of 1.425 V to 1.575 V to match typical FPGA core power domains.
• Package & Mounting  484-ball FPBGA (23 × 23) package in a surface-mount mounting type, providing a compact footprint for dense board layouts.
• Operating Range & Grade  Commercial-grade device specified for operation from 0 °C to 85 °C.
• Compliance  RoHS compliant for use in products requiring lead-free manufacturing processes.

Typical Applications

• Consumer Electronics  Implement custom logic, user interfaces and peripheral glue logic in compact, consumer-facing products.
• Communications Equipment  Provide protocol handling, packet processing and interface bridging using available logic and I/O resources.
• Embedded Control  Realize control loops, sensor interfacing and system coordination where medium-density programmable logic is required.
• Prototyping and Custom IP  Deploy custom hardware IP and iterate designs that need flexible reprogrammability and a substantial I/O count.

Unique Advantages

• Balanced Logic and Memory: 13,824 logic elements combined with 110,592 bits of embedded RAM deliver a balanced fabric for both control logic and local data storage.
• Generous I/O Count: 235 user I/Os support complex board-level interfaces and multiple peripheral connections without external multiplexing.
• Compact BGA Packaging: The 484-ball FPBGA (23×23) package enables a high pin-count solution in a space-efficient surface-mount form factor.
• Commercial Temperature Suitability: Rated for 0 °C to 85 °C operation, making it appropriate for a wide range of commercial applications.
• Manufacturer Backing: Produced by Microchip Technology, providing a known supply source for design and production needs.
• RoHS Compliant: Meets RoHS requirements for lead-free manufacturing and global regulatory alignment.

Why Choose M1A3P600-2FGG484?

The M1A3P600-2FGG484 positions itself as a commercial-grade FPGA option that combines substantial logic capacity, embedded memory and a high I/O count in a compact BGA package. It is suited for designers who need a programmable hardware solution for medium-complexity digital systems where board space and interface density matter.

Choosing this device offers a predictable, manufacturer-backed component for commercial embedded designs that demand on-chip RAM, flexible I/O and a robust logic element count—all within standard commercial temperature and power ranges.

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