M1A3P600-2PQG208

The M1A3P600-2PQG208 is a ProASIC3 Field Programmable Gate Array (FPGA) from Microchip Technology, offered in a 208-BFQFP package. It provides a balanced combination of logic, on-chip memory and I/O density for commercial embedded designs.

Key on-chip resources include 13,824 logic elements, approximately 110,592 bits of embedded RAM and 154 I/O pins. The device is specified for a supply voltage range of 1.425 V to 1.575 V and a commercial operating temperature range of 0 °C to 85 °C.

Key Features

• ProASIC3 FPGA core — Delivered as a Microchip Technology ProASIC3 device, providing a programmable platform for custom digital logic.
• Logic capacity — 13,824 logic elements and up to 600,000 gates for mid-range logic integration.
• Embedded memory — Approximately 110,592 bits of on-chip RAM to support buffers, state storage and intermediate data paths.
• I/O density — 154 general-purpose I/O pins to support multiple parallel interfaces and external peripherals.
• Package — 208-BFQFP (supplier package: 208-PQFP, 28×28) suitable for surface-mount PCB assemblies.
• Power — Single supply operating range from 1.425 V to 1.575 V for rail planning and power budgeting.
• Mounting and grade — Surface mount device in a commercial grade offering, with an operating range of 0 °C to 85 °C.
• Environmental compliance — RoHS compliant.

Typical Applications

• Custom digital control — Implement control logic and finite-state machines using the device's 13,824 logic elements and gate capacity.
• I/O-intensive interfaces — Bridge and manage multiple peripheral interfaces or parallel data paths with 154 available I/O pins.
• Embedded buffering and data handling — Use approximately 110,592 bits of on-chip RAM for temporary storage, FIFOs and data staging.
• Surface-mount system integration — Integrate the FPGA into compact PCBs using the 208-BFQFP footprint for space-efficient assemblies.

Unique Advantages

• Well-balanced resources: Combines 13,824 logic elements, ~110,592 bits of RAM and 154 I/O to support diverse mid-range designs without excessive external components.
• High I/O count: 154 I/O pins enable multiple parallel interfaces and flexible peripheral connectivity.
• Recognizable package footprint: 208-BFQFP (28×28) simplifies PCB layout and assembly planning for surface-mount production.
• Predictable power rail requirements: Narrow supply range of 1.425 V to 1.575 V aids in power-supply design and decoupling strategy.
• Commercial temperature and compliance: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial applications.

Why Choose M1A3P600-2PQG208?

The M1A3P600-2PQG208 positions itself as a practical ProASIC3 FPGA choice for designers seeking a mid-range programmable device with a strong balance of logic elements, on-chip RAM and I/O capacity. Its 208-BFQFP surface-mount package and defined supply and temperature ranges make it suitable for commercial embedded systems where predictable electrical and thermal parameters matter.

Backed by Microchip Technology as the manufacturer, this device is appropriate for teams and projects that require a deterministic set of resources—logic, memory and I/O—without adding speculation about features not listed in the product data.

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