M1A3P600-FG256

The M1A3P600-FG256 is a ProASIC3 Field Programmable Gate Array (FPGA) from Microchip Technology supplied in a 256-LBGA package. It provides reconfigurable logic resources and on-chip embedded memory suitable for commercial embedded designs.

With 13,824 logic elements and approximately 0.11 Mbits of embedded RAM, the device delivers a balance of logic density, I/O capacity and low-voltage operation for a range of digital design applications in commercial temperature environments.

Key Features

• Logic Capacity  13,824 logic elements (LAB/CLB count reported as 13,824) supporting complex user logic and custom datapaths.
• Gate Count  Approximately 600,000 gates, providing a measure of overall device density for implementing mid-range logic functions.
• Embedded Memory  110,592 bits of on-chip RAM (approximately 0.11 Mbits) for buffering, state storage and small lookup tables.
• I/O Resources  177 available I/O pins to support a variety of peripheral interfaces and board-level signals.
• Package & Mounting  256-LBGA package (supplier format: 256-FPBGA, 17×17) designed for surface-mount assembly on standard PCBs.
• Power  Core supply range specified at 1.425 V to 1.575 V to match system power rails and design constraints.
• Temperature & Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Compliance  RoHS compliant.

Typical Applications

• Embedded system prototyping  Use reprogrammable logic to validate and iterate hardware designs before production.
• Peripheral and interface control  Implement custom I/O handling, glue logic and protocol bridging using available I/O and logic resources.
• Custom digital signal processing  Leverage on-chip RAM and logic elements for small-scale DSP tasks and data buffering.
• Control and sequencing  Implement state machines, control logic and application-specific finite-state controllers within a compact package.

Unique Advantages

• Balanced logic and memory  13,824 logic elements paired with approximately 0.11 Mbits of embedded RAM enable compact implementations of control, buffering and moderate datapath functions.
• High I/O count in a compact package  177 I/O pins in a 256-LBGA footprint support multiple external interfaces while conserving board area.
• Low-voltage core operation  1.425 V to 1.575 V supply range aligns with modern low-voltage system architectures.
• Commercial temperature rating  Specified 0 °C to 85 °C operation suitable for a wide range of commercial applications.
• Surface-mount package  256-FPBGA (17×17) supplier format simplifies automated PCB assembly and high-density board designs.
• RoHS compliant  Conforms to common environmental requirements for commercial electronic products.

Why Choose M1A3P600-FG256?

The M1A3P600-FG256 positions itself as a commercial-grade ProASIC3 FPGA that combines mid-range logic density, embedded RAM and a high I/O count in a compact 256-LBGA package. Its electrical and thermal specifications make it suitable for designers looking to implement reconfigurable logic, interface control and moderate signal-processing tasks within commercial product envelopes.

Designed by Microchip Technology, the device offers a pragmatic balance of integration and board-level flexibility for teams focused on rapid prototyping, custom peripheral integration and compact system designs while maintaining RoHS compliance.

Request a quote or submit a purchase inquiry to receive pricing and availability for the M1A3P600-FG256.