M1A3P600-FG484

The M1A3P600-FG484 is a ProASIC3 flash-based FPGA from Microchip Technology. It combines reprogrammable nonvolatile flash technology with a high-density logic fabric and abundant I/O to support complex, instant-on digital designs.

Targeted at commercial embedded and system applications, this device delivers 600,000 system gates, 13,824 logic elements, and 235 user I/Os in a 484-ball BGA package, enabling compact, high-integration implementations where on-chip memory, configurable I/O, and secure in-system programming are required.

Key Features

• Logic Capacity  600,000 system gates and 13,824 logic elements provide a medium-density programmable fabric for control, glue logic, and moderate-complexity datapaths.
• Embedded Memory  Total on-chip RAM of 110,592 bits, approximately 0.11 Mbits of embedded memory for FIFOs, buffers, and state storage.
• User I/O  235 user I/Os to support extensive peripheral interfacing and multi-bank mixed-voltage connectivity.
• Nonvolatile Flash and Security  ProASIC3 family flash-based, reprogrammable architecture with on-chip FlashROM and family-level support for secure in-system programming (AES ISP and FlashLock features noted in the family datasheet).
• Clocking and Performance  Family-level clock conditioning with up to six integrated PLLs and high-performance routing; ProASIC3 family devices support system performance up to 350 MHz per the datasheet.
• Power and Supply  Device core supply specified at 1.425 V to 1.575 V to support low-power core operation.
• Package and Mounting  484-ball FPBGA (23 × 23) package, surface-mount mounting type suitable for compact board layouts.
• Operating Range and Compliance  Commercial-grade operating temperature range of 0 °C to 85 °C and RoHS-compliant status.

Typical Applications

• Embedded control and logic consolidation  Use the M1A3P600-FG484 to consolidate glue logic, state machines, and control functions into a single programmable device with nonvolatile configuration.
• Secure in-system programmable designs  Leverage on-chip FlashROM and family-level AES ISP/FlashLock capabilities for secure configuration and field updates.
• High-density I/O interfacing  With 235 user I/Os and mixed-voltage I/O support at the family level, the device is suited for designs requiring extensive peripheral connections and bank-selectable voltages.
• Prototyping and time-to-market projects  Reprogrammable flash technology enables iterative hardware development and lower unit cost compared with full ASIC flows for medium-complexity designs.

Unique Advantages

• Instant-on nonvolatile configuration: Flash-based architecture retains programmed design when powered off, simplifying system boot and eliminating external configuration memory.
• On-chip FlashROM and secure ISP: Integrated FlashROM and family support for AES-based in-system programming help streamline secure device updates and provisioning.
• Balanced capacity and I/O: 600k system gates with 13,824 logic elements and 235 I/Os delivers a balanced mix of logic resources and interfacing capability for mid-range designs.
• Compact BGA packaging: The 484-FPBGA (23×23) package provides a high-pin-count, space-efficient option for dense board-level integration.
• Commercial-grade operating range: Specified for 0 °C to 85 °C operation and RoHS compliance, suitable for a wide range of standard embedded applications.

Why Choose M1A3P600-FG484?

The M1A3P600-FG484 combines reprogrammable flash technology with mid-range gate capacity and substantial I/O to deliver a practical solution for designers seeking instant-on, secure, and compact programmable logic. Its combination of approximately 0.11 Mbits of on-chip RAM, 13,824 logic elements, and 235 user I/Os in a 484-BGA package makes it well suited for system integration tasks where board space, configuration retention, and flexible interfacing matter.

Backed by Microchip’s ProASIC3 family features—such as integrated PLL-based clock conditioning, on-chip FlashROM, and family-level security options—this device offers scalability and robustness for commercial embedded designs and prototype-to-production workflows.

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