M1A3P600-FGG144I

The M1A3P600-FGG144I is a ProASIC3 Field Programmable Gate Array (FPGA) from Microchip Technology, providing 13,824 logic elements and 600,000 gates in a compact 144-LBGA package. This industrial-grade FPGA combines a measurable logic capacity, embedded RAM, and a broad operating temperature range for use in demanding embedded and industrial applications.

Key Features

• Logic Capacity  13,824 logic elements (LEs) and 600,000 gates for implementing medium-complexity digital designs.
• Embedded Memory  Total on-chip RAM of 110,592 bits—approximately 0.11 Mbits—suitable for localized buffering and small data structures.
• I/O  97 user I/O pins to support multiple peripheral interfaces and board-level integration.
• Power  Operates from a supply voltage range of 1.425 V to 1.575 V for core power planning and regulator selection.
• Package & Mounting  144-LBGA (supplier package 144-FPBGA 13×13) in a surface-mount form factor for compact board layouts.
• Temperature Range  Industrial operating temperature from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Compliance  RoHS compliant for designs that require adherence to lead-free environmental standards.

Typical Applications

• Industrial Control  Implement custom logic, signal conditioning, and control algorithms within equipment that requires industrial temperature operation.
• Embedded Systems  Integrate medium-complexity digital functions and localized memory for compact embedded products.
• Communications Interfaces  Support interface glue logic and protocol handling using available I/O and logic resources.

Unique Advantages

• Significant Logic Density:  13,824 logic elements and 600,000 gates provide the resources to consolidate multiple functions in a single device, reducing board-level component count.
• On-chip Memory:  Approximately 0.11 Mbits of embedded RAM enables local buffering and state storage without external memory.
• Wide Operating Range:  Industrial temperature rating from −40 °C to 100 °C supports deployment in thermally demanding environments.
• Compact Package:  144-LBGA (13×13 FPBGA) surface-mount footprint allows for dense PCB layouts and space-constrained designs.
• Predictable Core Voltage:  Defined supply range of 1.425 V to 1.575 V simplifies power supply design and core rail selection.
• Environmental Compliance:  RoHS compliance assists with regulatory and environmental planning for product manufacturing.

Why Choose M1A3P600-FGG144I?

The M1A3P600-FGG144I positions itself as an industrial-grade FPGA option offering a balance of logic capacity, embedded memory, and robust thermal tolerance. Its combination of 13,824 logic elements, approximately 0.11 Mbits of on-chip RAM, and 97 I/O pins makes it suitable for embedded and industrial designs that require consolidated digital logic in a compact LBGA package.

Backed by Microchip Technology's ProASIC3 family characteristics, this device is appropriate for engineers seeking a single-device solution that supports surface-mount assembly, defined core voltage planning, and RoHS-compliant production.

Request a quote or contact sales to obtain pricing, availability, and lead-time information for the M1A3P600-FGG144I.