M1A3P600-FGG484I

The M1A3P600-FGG484I is a ProASIC3 field programmable gate array offering mid-range logic capacity and a substantial I/O count in a compact BGA package. It combines 600,000 gates and 13,824 logic elements with on-chip RAM and an industrial operating temperature range, making it suitable for designs that require robust logic integration and a high pin count.

Key Features

• Core Logic 13,824 logic elements providing a total of 600,000 gates for implementing complex digital functions.
• Embedded Memory Approximately 0.11 Mbits of on-chip RAM (110,592 bits) to support data buffering, state storage, and local memory requirements.
• I/O Capacity 235 I/O pins to support dense peripheral and interface connectivity in single-chip implementations.
• Power Narrow supply voltage range of 1.425 V to 1.575 V for the device core.
• Package & Mounting 484-ball BGA (supplier device package: 484-FPBGA, 23×23) in a surface-mount form factor for board-level integration and compact system layouts.
• Environmental & Grade Industrial-grade device with an operating temperature range of −40 °C to 100 °C and RoHS compliance for regulated manufacturing environments.

Typical Applications

• Industrial Control — Leverages the industrial temperature range and robust logic capacity for control algorithms, I/O handling, and interface glue logic in automation systems.
• High‑I/O Embedded Systems — 235 I/Os enable dense peripheral connectivity for embedded platforms requiring multiple interfaces or sensor arrays.
• Custom Logic Integration — Mid-range gate count and substantial logic elements make the device suitable for integrating custom state machines, protocol bridges, and timing-critical logic blocks.

Unique Advantages

• Significant Logic Density: 13,824 logic elements and 600,000 gates provide the capacity to consolidate multiple discrete functions into a single FPGA.
• Compact Board Footprint: 484-BGA (23×23) package supports high pin count in a space-efficient surface-mount solution.
• Generous On‑Chip Memory: Approximately 0.11 Mbits of embedded RAM for local buffering and state retention without external memory.
• High I/O Count: 235 I/Os simplify board-level routing and reduce the need for additional interface components.
• Industrial Reliability: Rated for −40 °C to 100 °C operation and RoHS compliant, supporting deployment in temperature-challenged environments.
• Stable Core Supply Window: Defined core voltage range (1.425 V–1.575 V) enables predictable power design and supply sequencing.

Why Choose M1A3P600-FGG484I?

The M1A3P600-FGG484I positions itself as a mid-density, industrial-grade FPGA option that balances logic capacity, I/O density, and compact packaging for embedded and control-focused designs. Its combination of 13,824 logic elements, 235 I/Os, on-chip RAM, and a 484-BGA footprint addresses designs that require consolidation of multiple functions while maintaining a small board area.

This device is well suited for engineers specifying FPGAs for industrial applications and embedded systems that demand robust thermal tolerance and high connectivity. The clearly defined electrical and mechanical parameters simplify integration and long-term design planning.

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