M1A3P600-PQ208

The M1A3P600-PQ208 is a ProASIC3 field programmable gate array (FPGA) from Microchip Technology built on a flash-based, low-power architecture. It combines a substantial logic fabric with on-chip RAM and a high I/O count to address I/O-dense embedded designs.

This device is specified for commercial temperature operation and RoHS-compliant manufacturing, making it suitable for a wide range of general-purpose embedded applications that require compact surface-mount packaging and deterministic, nonvolatile configuration.

Key Features

• Logic Capacity — Provides 13,824 logic elements (reported as Labs/CLBs in source data) supporting approximately 600,000 equivalent gates for implementing medium-complexity digital functions.
• On‑Chip Memory — Includes 110,592 total RAM bits of embedded memory to support data buffering, state machines, and local storage requirements.
• I/O Density — 154 user I/Os enable consolidation of multiple interfaces and flexible board-level connectivity.
• Flash-Based Architecture & Flash*Freeze — Flash configuration with Flash*Freeze technology (as described in the ProASIC3 family documentation) for low-power standby and nonvolatile configuration retention.
• Power Supply — Core voltage range specified from 1.425 V to 1.575 V for predictable power budgeting in system designs.
• Package & Mounting — Surface-mount 208‑BFQFP (supplier package listed as 208‑PQFP, 28×28) for compact, board-level integration.
• Operating Range & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance — RoHS compliant to support modern, lead‑free assembly processes.

Typical Applications

• I/O‑dense system control: Use the 154 I/Os to consolidate peripheral interfaces and implement board‑level glue logic for embedded controllers and control panels.
• Protocol bridging and interface conversion: The combination of logic capacity and on‑chip RAM supports protocol translation and buffering tasks between disparate subsystems.
• Embedded logic and state machines: Implement finite-state machines, sequencers, and custom control logic using the 13,824 logic elements and embedded memory.
• Compact, surface‑mount designs: The 208‑BFQFP package suits space‑constrained PCBs where a surface‑mount FPGA is required for integration and performance.

Unique Advantages

• High integration density: 13,824 logic elements and approximately 600,000 equivalent gates let you integrate multiple discrete functions into a single device, reducing BOM and board area.
• Substantial on‑chip memory: 110,592 bits of embedded RAM enable local data buffering and fast state handling without external memory.
• Generous I/O count: 154 I/Os provide flexibility to connect sensors, peripherals, and interfaces directly to the FPGA, minimizing external logic.
• Predictable low‑voltage operation: A defined core supply range (1.425–1.575 V) helps with consistent power design and margining in mixed-voltage systems.
• Surface‑mount packaging: The 208‑pin BFQFP solution supports compact PCB layouts and standard SMT assembly flows.
• RoHS compliant: Supports lead‑free manufacturing and modern environmental requirements.

Why Choose M1A3P600-PQ208?

The M1A3P600-PQ208 positions itself as a commercial-grade, flash-configured FPGA that balances logic capacity, embedded memory, and high I/O density in a compact surface-mount package. Its flash-based configuration and Flash*Freeze capability provide nonvolatile configuration behavior with low-power standby characteristics described for the ProASIC3 family.

This device is well suited to engineers developing medium-complexity embedded systems, interface and protocol bridging solutions, and compact board-level controllers where predictable power, a high I/O count, and on-chip memory are important design drivers.

Request a quote or submit a product inquiry to check availability, pricing, and to begin a procurement or technical qualification process for the M1A3P600-PQ208.