M1A3P600-FGG484

The M1A3P600-FGG484 is a ProASIC3 Field Programmable Gate Array (FPGA) IC from Microchip Technology. It delivers a balance of programmable logic capacity, embedded memory, and I/O density in a compact 484-ball fine-pitch BGA package.

Key device characteristics include 13,824 logic elements, approximately 0.11 Mbits of on-chip RAM, 235 user I/O pins, and a supply voltage range of 1.425 V to 1.575 V. The part is qualified for commercial-grade operation from 0 °C to 85 °C and is RoHS compliant.

Key Features

• Logic Capacity  13,824 logic elements provide substantial programmable fabric for implementing complex combinational and sequential logic.
• Embedded Memory  Approximately 0.11 Mbits of on-chip RAM for data buffering, FIFOs, and small scratch storage within the FPGA fabric.
• I/O Density  235 available I/O pins support multiple external interfaces and parallel connections in a single device.
• Gate Count  600,000 gates indicating overall device density for mixed logic and glue-logic tasks.
• Power  Narrow supply voltage window of 1.425 V to 1.575 V for device core operation.
• Package & Mounting  484-ball fine-pitch BGA (484-FPBGA, 23 × 23) in a surface-mount package that optimizes board area for high-density designs.
• Operating Range  Commercial operating temperature from 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant for reduced hazardous substances.

Typical Applications

• Embedded Control  Use the device to implement programmable control logic and state machines where compact logic capacity and embedded RAM are required.
• Interface Bridging  High I/O count enables implementation of protocol bridging, parallel/serial conversion, and custom interface logic.
• Prototype and Development  Suitable for developing and validating custom logic functions before scaling to production designs.

Unique Advantages

• Substantial Logic Density: 13,824 logic elements allow integration of multiple logic blocks into a single device, reducing overall BOM and board complexity.
• On-chip Memory: Approximately 0.11 Mbits of embedded RAM supports local buffering and data handling without external memory.
• High I/O Count: 235 I/Os provide flexibility to connect numerous peripherals and external devices directly to the FPGA.
• Compact BGA Package: 484-FPBGA (23 × 23) enables a high pin count in a space-efficient footprint for dense board layouts.
• Commercial Temperature Rating: Rated 0 °C to 85 °C for designs targeted at commercial environments.
• Regulatory Compliance: RoHS compliance supports environmental and regulatory requirements for many product lines.

Why Choose M1A3P600-FGG484?

The M1A3P600-FGG484 positions itself as a capable FPGA for commercial designs that need a balance of logic elements, embedded memory, and broad I/O in a compact BGA package. Its defined supply range and commercial temperature rating make it suitable for a wide range of embedded and interface-focused applications where verified, predictable electrical and thermal behavior is required.

Engineers and procurement teams selecting this part gain a programmable, integrated option that helps consolidate discrete logic, reduce board-level complexity, and shorten development cycles while maintaining compliance with RoHS requirements.

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