M1A3P600-FGG144

The M1A3P600-FGG144 is a ProASIC3 family Field Programmable Gate Array (FPGA) IC from Microchip Technology, provided in a 144-LBGA package. It delivers a balanced combination of programmable logic, I/O count and embedded memory for commercial-grade programmable logic applications.

This device is targeted at designs needing approximately 13,824 logic elements, around 97 I/Os, and embedded memory while maintaining a compact surface-mount footprint and standard commercial temperature range.

Key Features

• Logic Capacity The device contains 13,824 logic elements, enabling mid-density programmable logic implementations and complex glue-logic or control functions.
• Embedded Memory Approximately 0.11 Mbits of on-chip RAM (110,592 total RAM bits) for implementing buffers, state machines, and small data storage needs.
• I/O Resources 97 user I/Os provide flexible external interfacing for sensors, peripherals, and system interconnects.
• Gate Count Approximately 600,000 gates of integration for combining logic and peripheral functions on a single device.
• Power and Voltage Operates from a core supply range of 1.425 V to 1.575 V, suitable for designs with defined low-voltage core rails.
• Package and Mounting Supplied in a 144-LBGA package (supplier device package: 144-FPBGA, 13×13) designed for surface-mount placement on compact PCBs.
• Temperature and Grade Commercial-grade device rated for operation from 0 °C to 85 °C.
• Regulatory Compliance RoHS compliant for lead-free manufacturing processes and environmental compliance.

Typical Applications

• Embedded Control — Implement glue logic, control state machines, and peripheral management in space-constrained commercial electronics.
• Interface Bridging — Provide mid-density I/O expansion and protocol bridging between processors and external devices using the device's 97 I/Os.
• Signal Processing Blocks — Deploy on-chip RAM and logic elements for small-scale buffering and logic-intensive datapath functions.

Unique Advantages

• Balanced Logic and Memory: 13,824 logic elements paired with approximately 0.11 Mbits of embedded RAM offer a versatile resource mix for a range of mid-density designs.
• Substantial I/O Count: Ninety-seven I/Os enable flexible connectivity to peripherals, sensors, and external interfaces without adding extra components.
• Compact Surface-Mount Package: The 144-LBGA (144-FPBGA, 13×13) package minimizes PCB area while supporting robust board-level integration.
• Controlled Core Voltage: A defined core supply range (1.425 V–1.575 V) helps simplify power-rail planning for low-voltage systems.
• Commercial Temperature Rating: Rated 0 °C to 85 °C for standard commercial deployments.
• RoHS Compliant: Conforms to lead-free manufacturing requirements for environmentally conscious production.

Why Choose M1A3P600-FGG144?

The M1A3P600-FGG144 positions itself as a practical choice for commercial programmable-logic designs that require a moderate logic element count, meaningful on-chip memory, and a substantial number of I/Os in a compact LBGA footprint. Its defined core voltage range, surface-mount 144-LBGA package, and RoHS compliance make it suitable for space-conscious boards where manufacturability and environmental compliance matter.

Backed by Microchip Technology as the manufacturer, the device is appropriate for engineers and procurement teams seeking a mid-density FPGA solution for control, interface, and embedded logic functions in commercial products and prototypes.

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