M1A3P600-FG256I

The M1A3P600-FG256I is a ProASIC3 Field Programmable Gate Array (FPGA) IC offered in a 256-LBGA package. It delivers a configurable logic fabric with 13,824 logic elements, up to 600,000 gates and approximately 0.11 Mbits of embedded RAM for custom digital designs.

Designed to meet industrial temperature and supply requirements, this surface-mount FPGA combines a high I/O count with on-chip memory and a compact 256-FPBGA (17×17) footprint to support robust, space-constrained system designs.

Key Features

• Logic Capacity — 13,824 logic elements providing a total of 600,000 gates for implementing custom digital functions and control logic.
• Embedded Memory — Approximately 0.11 Mbits (110,592 bits) of on-chip RAM for buffering, state storage, and small data structures.
• I/O Resources — 177 user I/O pins to support a wide range of interfacing and peripheral connectivity requirements.
• Power — Operates from a core supply in the range of 1.425 V to 1.575 V to match system power domains and design constraints.
• Package & Mounting — Available in a 256-LBGA (supplier package: 256-FPBGA 17×17) surface-mount package for compact PCB implementations.
• Operating Range — Industrial temperature grade with an operating range of -40 °C to 100 °C for deployment in demanding environments.
• RoHS Compliance — RoHS compliant construction suitable for environmentally regulated products.

Typical Applications

• Industrial Control — Use the FPGA’s logic capacity and industrial temperature range for custom control and interfacing tasks in automation equipment.
• Embedded System Integration — Implement glue logic, peripheral aggregation, and protocol adaptation using the high I/O count and on-chip RAM.
• Communication Interfaces — Deploy configurable I/O and logic to support custom or evolving interface requirements in networking and instrumentation modules.

Unique Advantages

• Substantial Logic Density: 13,824 logic elements and 600,000 gates enable complex combinational and sequential logic implementations within a single device.
• Compact Packaging: 256-LBGA (17×17 FPBGA) provides a small PCB footprint for space-constrained designs without sacrificing I/O count.
• Industrial Temperature Rating: Rated from -40 °C to 100 °C to support deployment in harsher operating environments.
• Flexible I/O Count: 177 I/Os allow integration of multiple peripherals and interfaces directly to the FPGA fabric, reducing external components.
• Controlled Core Voltage: Narrow core supply range (1.425 V–1.575 V) for predictable power design and supply rail integration.
• Regulatory Compliance: RoHS compliant to meet environmental material requirements for commercial and industrial products.

Why Choose M1A3P600-FG256I?

The M1A3P600-FG256I positions itself as a compact, industrial-grade FPGA option for designs requiring substantial logic resources, a high I/O count, and on-chip memory in a 256-LBGA package. Its combination of 600,000 gates, 13,824 logic elements, and approximately 0.11 Mbits of RAM supports a wide range of custom digital functions while maintaining a small PCB footprint.

This device is well suited for engineering teams building industrial control systems, embedded integration modules, or communication interfaces that require predictable operating temperature performance and RoHS-compliant components. The specified electrical, mechanical, and environmental parameters make it a pragmatic choice for long-term, ruggedized deployments.

Request a quote or submit an inquiry to get pricing and lead-time information for the M1A3P600-FG256I. Our team can assist with part availability and procurement details to support your design and production timelines.