M1A3P600-FG144

IC FPGA 97 I/O 144FBGA
Part Description

ProASIC3 Field Programmable Gate Array (FPGA) IC 97 110592 144-LBGA

Quantity 995 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package144-FPBGA (13x13)GradeCommercialOperating Temperature0°C – 85°C
Package / Case144-LBGANumber of I/O97Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs13824Number of Logic Elements/Cells13824
Number of Gates600000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits110592

Overview of M1A3P600-FG144 – ProASIC3 Field Programmable Gate Array (FPGA) IC 97 110592 144-LBGA

The M1A3P600-FG144 is a ProASIC3 family flash-based FPGA from Microchip Technology. It delivers reprogrammable FPGA capability with 600,000 system gates and 13,824 logic elements in a compact 144-LBGA package, targeting applications that require secure, nonvolatile, instant-on programmable logic.

Its combination of embedded memory, mixed-voltage I/O support, and integrated system features makes it suitable for high-density logic integration, custom interface bridging, and embedded system designs that depend on retention of programmed logic through power cycles.

Key Features

  • Core Capacity – 600,000 system gates and 13,824 logic elements provide substantial programmable logic capacity for complex functions and glue-logic integration.
  • Embedded Memory – Total on-chip RAM of 110,592 bits (approximately 0.11 Mbits) plus family-level support for 1 kbit of on-chip FlashROM for nonvolatile storage.
  • I/O and Interfaces – 97 user I/Os with family-level Pro I/O capabilities that include mixed-voltage operation and high-speed differential and single-ended standards support, enabling flexible interfacing to a wide range of peripherals and busses.
  • Clocking and Timing – Family-level clock conditioning circuitry includes multiple CCC/PLL resources for clock multiplication, phase shift and conditioning to support synchronous designs.
  • Security and In-System Programming – Family features include in-system programming with on-chip AES-128 decryption and FlashLock security to protect programmed contents.
  • Power and Voltage – Core supply operating range of 1.425 V to 1.575 V for low-power core operation; supports mixed-voltage I/O banks per family capabilities.
  • Package and Mounting – Surface-mount 144-LBGA package; supplier device package listed as 144-FPBGA (13×13) for compact board-level integration.
  • Temperature and Compliance – Commercial operating temperature range from 0 °C to 85 °C; RoHS compliant.

Typical Applications

  • Secure Embedded Systems – Use when nonvolatile, reprogrammable logic and on-chip Flash security (AES ISP, FlashLock) are required to retain and protect firmware and logic across power cycles.
  • Interface Bridging and I/O Aggregation – 97 user I/Os and family-level mixed-voltage I/O support enable consolidation of multiple peripheral interfaces or protocol conversion functions.
  • High-Density Logic Integration – 600k system gates and 13,824 logic elements allow integration of custom logic that reduces external glue components and simplifies PCB design.
  • Prototyping and ASIC Replacement – Reprogrammable flash technology supports iterative development and transition toward ASIC-level unit cost while retaining design flexibility.

Unique Advantages

  • Highly integrated logic and memory: 600,000 system gates combined with 13,824 logic elements and approximately 0.11 Mbits of embedded RAM reduce BOM and board complexity.
  • Nonvolatile, instant-on operation: Flash-based architecture retains the programmed design when powered off, enabling immediate startup without external configuration memory.
  • Secure in-system updates: On-chip AES-128 decryption for ISP and FlashLock features protect bitstream integrity and enable secure field updates.
  • Flexible I/O interfacing: Family-level multi-voltage I/O and high-speed differential options support a wide range of external devices and signaling standards.
  • Compact, surface-mount package: 144-LBGA / 144-FPBGA (13×13) footprint supports dense board designs while meeting RoHS requirements.
  • Family scalability: Part of the ProASIC3 family that spans multiple density points, enabling design scalability across higher or lower capacity devices within the same product family.

Why Choose M1A3P600-FG144?

The M1A3P600-FG144 delivers a balanced combination of logic capacity, embedded memory, secure in-system programming, and flexible I/O in a compact, RoHS-compliant BGA package. As a ProASIC3 flash FPGA from Microchip Technology, it is well suited for designers who need reprogrammable, nonvolatile FPGA capability for embedded systems, interface consolidation, and prototyping where retention of programmed logic and secure updates matter.

Being part of the ProASIC3 family provides a clear upgrade path to higher-density devices within the same architecture, helping designs scale while leveraging common family-level features and capabilities.

Request a quote or submit an RFQ to get pricing and availability for the M1A3P600-FG144 and discuss how it fits your design requirements.

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