M1A3P600-2PQG208I

The M1A3P600-2PQG208I is a ProASIC3 field programmable gate array (FPGA) in a 208‑BFQFP package designed for industrial-grade embedded designs. It provides a mid-range logic capacity and on-chip memory with a broad operating temperature range to support robust system-level integration.

This device is aimed at applications that require up to 154 I/O, moderate embedded memory, and a clear set of electrical and thermal operating parameters, enabling reliable deployment in industrial and embedded systems.

Key Features

• Core Logic  13,824 logic elements (cells) delivering approximately 600,000 equivalent gates for implementing custom digital functions.
• Embedded Memory  Approximately 0.11 Mbits (110,592 bits) of on-chip RAM for buffering, FIFOs, and small data storage.
• Flexible I/O  154 general-purpose I/O pins to support a variety of peripheral and interface connections.
• Power  Single core supply range specified at 1.425 V to 1.575 V for predictable power integration.
• Package & Mounting  208‑BFQFP package (supplier device package: 208‑PQFP 28×28) with surface-mount mounting for PCB assembly compatibility.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to suit industrial and harsh-environment applications.
• Compliance  RoHS compliant to support regulatory requirements for lead-free assemblies.

Typical Applications

• Industrial Control  Implement motor control logic, sensor interfacing, and machine coordination using the device’s logic capacity and 154 I/O lines.
• Embedded Systems  Use as glue logic, protocol adaptation, or custom state machines where moderate on-chip RAM and configurable logic are required.
• I/O-Intensive Interfaces  Deploy where multiple parallel inputs/outputs are needed for data aggregation, switching, or signal preprocessing.
• Test and Measurement  Leverage the device’s logic and memory resources to implement signal conditioning, control logic, and data buffering in instrumentation designs.

Unique Advantages

• High Logic Capacity: 13,824 logic elements and approximately 600,000 gates provide substantial implementation resources for mid-range designs.
• On-Chip Memory: 110,592 bits of embedded RAM enable local buffering and small data storage without external memory.
• Generous I/O Count: 154 I/O pins allow direct connection to multiple peripherals and sensors, reducing the need for external I/O expanders.
• Industrial-Grade Operation: Specified operation from −40 °C to 100 °C supports deployment in industrial environments.
• Standard Surface-Mount Package: 208‑BFQFP (208‑PQFP 28×28) provides a familiar footprint for PCB layout and assembly processes.
• Predictable Power Envelope: Narrow core supply range (1.425 V to 1.575 V) simplifies power supply design and sequencing.

Why Choose M1A3P600-2PQG208I?

The M1A3P600-2PQG208I delivers a balanced combination of logic density, embedded memory, and I/O capability in a RoHS‑compliant, industrial‑rated package. Its defined electrical and thermal limits make it suitable for engineers designing reliable embedded and industrial systems that require configurable digital logic and substantial I/O.

Choose this device when you need a mid-range FPGA solution that provides tangible on‑chip resources and clear package and operating specifications for predictable system integration.

Request a quote or contact sales to obtain pricing and availability for the M1A3P600-2PQG208I.